A kind of heat dissipation tooling and application of patch ceramic disk used in LED chip substrate thinning process

Abstract

The invention relates to a heat dissipation tool for chip ceramic discs in the LED chip substrate thinning process and an application thereof. The heat dissipation tooling of the present invention includes a circulating water tank, the upper surface of the circulating water tank is provided with a positioning groove for fixing the ceramic disc, the shape of the positioning groove corresponds to the shape of the ceramic disc; the upper surface of the circulating water tank is surrounded by A baffle; the inside of the circulating water tank is provided with a U-shaped heat-absorbing pipe, and the U-shaped heat-absorbing pipe communicates with the external circulating water through a water inlet pipe and a water return pipe. The heat dissipation tooling of the patch ceramic disk of the present invention effectively solves the problem of rapid cooling of the ceramic disk under the condition of recycling the ceramic disk in the actual production operation, ensures the smoothness of the production operation, and effectively prevents the operator from directly The burn caused by touching the high-temperature ceramic plate ensures the safety of the operators; the structure is simple and the operation is simple and easy.

Description

technical field [0001] The invention relates to a heat dissipation tool for chip ceramic discs in the LED chip substrate thinning process and an application thereof, belonging to the technical field of the semiconductor thinning process. Background technique [0002] With the continuous development of technology, LED chips continue to develop towards high density, high performance, miniaturization and lightness. Among them, the thinning of devices is one of the key development directions of power devices and photovoltaic devices in recent years. On the one hand, the thin sheet can reduce the on-resistance and voltage drop of the device, thereby greatly reducing the conduction loss of the device, improving the performance of the device in terms of heat dissipation, and preventing the excessive temperature rise of the active area of ​​the LED chip from affecting the light output characteristics and On the other hand, in order to meet the requirements of subsequent processes s...

AI Technical Summary

Problems solved by technology

[0005] In actual operation, the number of ceramic disks is limited, and it is recycled from the start of placement to the completion of the next piece of work. However, the heated ceramic disks need to be cooled before they can be put into a new round of use. Ceramic disks The natural cooling method is usually used for cooling. The slow cooling speed affects the recycling efficiency of the ceramic disk and restricts the smoothness of the thinning operation of the chip substrate. There is also a method of immersing the heated ceramic disk in water to cool it. Although the method improves the cooling speed of the ceramic plate, there are still more shortcomings: First, the surface of the ceramic plate itself has a relatively slippery wax, which is easy to slip when soaking in water and taking it, causing the ceramic plate to fall and break. The second is that the water container for cooling the ceramic discs is fixed. After cooling a certain number of ceramic discs, the water temperature will rise, and the cooling effect will gradually decrease.

[0006] At present, there are no related patents or literature reports on the tooling and working methods for chip ceramic disc heat dissipation in the LED chip substrate thinning process

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