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Dimer diamine composition, method for producing same and resin film

A manufacturing method and a dimer technology are applied in the field of dimer diamine compositions, which can solve the problems of longer signal delay time and electrical signal loss, and achieve the effects of improved stabilization, improved yield and improved quality.

Pending Publication Date: 2019-07-12
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the transmission loss in the transmission path is large when transmitting high-frequency signals, problems such as loss of electrical signals or long delay times of signals occur

Method used

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  • Dimer diamine composition, method for producing same and resin film
  • Dimer diamine composition, method for producing same and resin film
  • Dimer diamine composition, method for producing same and resin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122]Put 56.22g of BTDA (0.174 mole), 93.78g of DDA1 (0.176 mole), 210g of NMP and 140g of xylene into a 1000ml separable flask, and mix thoroughly for 1 hour at 40°C to prepare polyamic acid solution. The polyamic acid solution was warmed up to 190° C., heated and stirred for 4 hours, and 140 g of xylene was added to prepare polyimide solution 1 (solid content: 30% by weight, weight average molecular weight: 63,300 ). The obtained polyimide solution 1 was coated on one side of a polyethylene terephthalate (PET) film that had been subjected to release treatment, and dried at 80°C for 15 minutes to prepare a resin Film 1 (thickness: 22 μm). Table 2 shows the thickness, light transmittance (400 nm transmittance), b*, YI, total light transmittance (T.T.), and HAZE (haze) of the resin film 1 .

Embodiment 2～ Embodiment 5

[0124] Except having used DDA shown in Table 1, it carried out similarly to Example 1, and prepared the polyimide solution 2 - the polyimide solution 5. The thickness, light transmittance (400nm transmittance), b*, YI, total light transmittance ( T.T.), HAZE (turbidity) are shown in Table 2.

[0125] [Table 2]

[0126]

[0127] [DDA6~DDA8]

[0128] DDA6: manufactured by Croda Japan Co., Ltd., trade name: PRIAMINE 1075 (component (a): 97.0% by weight, component (b): 0.7%, component (c): 2.3%)

[0129] DDA7: manufactured by Croda Japan Co., Ltd., trade name: PRIAMINE 1075 (component (a): 95.8% by weight, component (b): 0.2%, component (c): 4.0%)

[0130] DDA8: manufactured by Croda Japan Co., Ltd., trade name: PRIAMINE 1075 (component (a): 97.3% by weight, component (b): 0.2%, component (c): 2.5%)

[0131] When the aliphatic double bond ratio and the aromatic ring ratio, light transmittance (400 nm transmittance), b*, and YI of DDA6 to DDA8 are calculated, they are as sho...

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Abstract

The invention provides a dimer diamine composition, a method for producing same and a resin film, which is prepared from the dimer diamine composition and has high transparency and a low colored degree. The dimer diamine composition is mainly composed of dimer diamine, which is formed by substituting two terminal carboxylic acid groups of dimeric acids by primary amino methyl or amino. The contentof aliphatic double bonds quantified by 1H-NMR is 1.0 mol.% or lower with respective to -CH2- of NH2CH2- (1 mole). When the thickness of the resin film with a diamine content of 40 mol.% or more is 30 [mu]m, i) the transmittance of light with a wavelength of 400 nm is 70% or more; ii) the YI value is 5 or less; and iii) the full light transparency (T.T.) is 90% or more.

Description

technical field [0001] The present invention relates to a dimer diamine composition comprising dimer diamine as a main component, a method for producing the same, and a resin film. Background technique [0002] In recent years, with the advancement of miniaturization, weight reduction, and space saving of electronic equipment, flexible printed wiring boards (FPC; Flexible Printed Circuits) that are thin, lightweight, flexible, and have excellent durability even after repeated bending needs increase. FPC can achieve three-dimensional and high-density packaging even in a limited space. Therefore, for example, in hard disk drives (Hard Disk Drive, HDD), digital video disks (Digital Video Disk, DVD) The use of parts such as wiring, cables, and connectors is expanding. [0003] In addition, it is also necessary to cope with the increase in frequency of transmission signals due to the further advancement of higher functionality of electronic equipment. When the transmission los...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/10C08G73/12C08G73/1007C07C209/70C07C209/84C08G73/1042C08J5/18C08J2379/08
Inventor 山田裕明柿坂康太须藤芳树西山哲平
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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