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Memory, working method thereof, and forming method thereof

A working method and memory technology, applied in static memory, digital memory information, information storage and other directions, can solve the problems of low integration of single-transistor static memory, and achieve the effects of simple structure, small area and high integration

Active Publication Date: 2019-07-12
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the integration level of existing single-transistor SRAMs is still low

Method used

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  • Memory, working method thereof, and forming method thereof
  • Memory, working method thereof, and forming method thereof
  • Memory, working method thereof, and forming method thereof

Examples

Experimental program
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Embodiment Construction

[0035] There are many problems in storage, for example: the volume of the memory is relatively large, and the degree of integration is low.

[0036] Combining with a single-transistor static memory, the reasons for the low integration level of the prior art single-transistor static memory are analyzed:

[0037] figure 1 It is a schematic diagram of the structure of a single-transistor static memory.

[0038] Please refer to figure 1 , the memory includes a plurality of memory cells, the memory cells include: a substrate 10, an n well 13 and a p well 14 located in the substrate 10, the p well 14 and the n well 13 are vertical to the substrate 10 arranged in the direction of the surface; the gate structure 15 located on the surface of the p-well 14; the word line WL connected to the gate structure 15; the source region 11 and the drain region 12 located on both sides of the gate structure 15, so The source region 11 and the drain region 12 are n-type ion doped regions; the so...

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PUM

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Abstract

The invention provides a memory, a working method thereof, and a forming method thereof. The memory comprises a substrate, a first well region which is in the substrate and has a first dopant ion, a second well region which is at the top surface of the first well region and has a second dopant ion whose conductivity type is opposite to that of the first dopant ion, a gate structure at the surfaceof the second well region, and a doped region in the second well region on one side of the gate structure, wherein the doped region has a third dopant ion whose conductivity type is opposite to that of the second dopant ion. The memory has the advantages of simple structure and high integration degree.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a memory and its working method and forming method. Background technique [0002] With the development of information technology, the amount of stored information has increased dramatically. The increase in the amount of stored information has promoted the rapid development of the memory, and at the same time put forward higher requirements for the performance of the memory. [0003] Since the static memory (SRAM) can save the data stored in it without refreshing the circuit, and the power consumption is small, the application of the SRAM is more and more extensive. A traditional SRAM storage unit generally consists of six MOS transistors or four MOS transistors, and the number of MOS transistors in the storage unit is large, resulting in a large volume of the MOS transistors. In order to reduce the size of the memory and improve the integration level, a sin...

Claims

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Application Information

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IPC IPC(8): H01L27/11H01L21/8244G11C11/411H10B10/00
CPCG11C11/411H10B10/12
Inventor 廖淼潘梓诚
Owner SEMICON MFG INT (SHANGHAI) CORP
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