Chemical mechanical planarization device and wafer transmission method

Abstract

The invention discloses a chemical mechanical planarization device and a wafer transmission device and method. The wafer transmission device comprises at least one wafer polishing transmission mechanical arm, the wafer polishing transmission mechanical arm comprises a horizontal transmission mechanism, a vertical transmission mechanism and a wafer grabbing device, a polishing transfer table, a cleaning transfer table and a polishing loading table are arranged in the movable range, in the horizontal straight line moving direction, of the wafer grabbing device, according to the wafer transmission device, the wafer can be directly transmitted among the polishing transfer table, the polishing loading table and the cleaning transfer table, due to the fact that transfer is not needed, the wafertransfer frequency is reduced, the wafer transmission time is shortened, the transmission efficiency is improved, and the probability of damage generated by wafer transmission is reduced. Due to layout of the chemical mechanical planarization device, the transmission stroke is reduced, and machining efficiency of the chemical mechanical planarization device is obviously improved on year-on-year basis.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to chemical mechanical planarization equipment, wafer transmission equipment and a wafer transmission method. Background technique [0002] With the rapid development of the semiconductor industry, the feature size of integrated circuits tends to be miniaturized, so the high planarization of the semiconductor thin film surface has an important impact on the high performance, low cost and high yield of the device. [0003] Chemical mechanical polishing (Chemical Mechanical Planarization, CMP) technology is a combination of chemical action and mechanical action. Its working principle is that first, the surface material of the workpiece reacts chemically with the oxidant and catalyst in the polishing liquid to form a soft layer that is relatively easy to remove, and then removes the soft layer under the mechanical action of the abrasive and the polishing pad in the poli...

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Problems solved by technology

[0009] One of the objectives of the present invention is to propose a new type of chemical mechanical planarization equipment with a polishing unit array layout for the problems of low wafer transmission efficiency and complex structure of the transmission mechanism in the existing chemical mechanical planarization equipment, and based on the array layout A wafer transfer module is proposed, which is arranged above the polishing unit array, so that the wafer transfer unit of the wafer transfer module can pass through the polishing unit at any time without being disturbed

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