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A device for dynamic monitoring of tough and brittle removal in ultra-precision machining of ceramic materials

A technology of ultra-precision machining and ceramic materials, applied in stone processing tools, stone processing equipment, work accessories, etc., can solve the problems of wasting materials, consuming energy, and prolonging the test period.

Active Publication Date: 2020-12-04
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method has many disadvantages such as wasting materials, consuming energy, and prolonging the test period.

Method used

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  • A device for dynamic monitoring of tough and brittle removal in ultra-precision machining of ceramic materials
  • A device for dynamic monitoring of tough and brittle removal in ultra-precision machining of ceramic materials

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Embodiment Construction

[0024] The technical solutions thereof will be further elaborated below with reference to the accompanying drawings and specific embodiments.

[0025] like figure 1 Shown is a schematic structural diagram of a device for dynamically monitoring ductile and brittle removal in ultra-precision machining of ceramic materials according to the present invention. The device includes an ultra-precision machining system, a cooling system, a data acquisition system, a logic judgment system, and a processing speed and depth control system.

[0026] The ultra-precision machining system includes a lathe, a tool and a ceramic workpiece, and is used for ultra-precision machining of ceramic materials.

[0027] The cooling system consists of coolant, coolant sprayers and coolant recovery tanks to facilitate process heat dissipation.

[0028] The data acquisition system is composed of a micro-nano imager and a data feedback computer, and is used to collect and record the data on the surface are...

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Abstract

The invention discloses a device for dynamically monitoring an ultra-precise machining toughness and brittleness removal of ceramic material. The device adopts a micro-nano imager to calculate the surface area of a workpiece in the ultra-precise machining process, the qualitative relation of the microstructure evolution and the surface area variation trend is adopted to predict that the ceramic material is subjected to ultra-precision machining to be subjected to toughness removal or brittle removal. Therefore, by changing the ultra-precise machining speed, the toughness is removed, the sub-surface damage is reduced, and the surface integrity is improved. The device can simply, conveniently and quickly judge a material removal mechanism in the ultra-precise machining process of brittle materials, the complexity and the difficulty caused by the fact that a complex in-situ scanning electron microscope or transmission electron microscope is used for judging the material removal mechanismby observing the evolution of the microstructure are avoided, and meanwhile, manpower and material resources are saved, and the material waste is avoided.

Description

technical field [0001] The invention relates to a device for dynamically monitoring the ultra-precision machining of ceramic materials and adjusting the removal mode, in particular to a device for dynamically monitoring the ultra-precision machining of ceramic materials for ductile and brittle removal. Background technique [0002] Due to their superior physical and mechanical properties, ceramic materials have been widely used in the fields of machinery, electronics, aerospace, defense and military industry, bionic devices, and robots. However, with the development of mechanical products in the direction of "high, precise and sharp", the performance requirements of ceramic devices are becoming more and more demanding, such as high surface integrity and low subsurface damage. At the same time, the hardness and brittleness of the ceramic material itself make it inevitable to produce processing damage and cracks in the process of processing, which reduces its reliability. The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/16B28D7/00B28D7/02
CPCB28D1/16B28D7/005B28D7/02
Inventor 李甲方棋洪田圆圆易明
Owner HUNAN UNIV
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