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Polishing method and device based on heat rheological material

A polishing device and thermo-rheological technology, applied in grinding/polishing safety devices, grinding/polishing equipment, surface polishing machine tools, etc., can solve the problems of low automation, high processing efficiency, low polishing efficiency, etc., and achieve automation High degree of effect at low cost and high material removal rate

Active Publication Date: 2018-08-10
XIANGTAN UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of poor adaptability of polishing media to complex profiles, low polishing efficiency, low degree of automation, and high cost in the existing polishing technology, the present invention provides a polishing process based on thermorheological materials with high processing efficiency and low cost. Method and device

Method used

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  • Polishing method and device based on heat rheological material

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Embodiment Construction

[0026] refer to figure 1 and figure 2 , a polishing method based on photorheological materials in this embodiment, used in combination with existing polishing equipment, includes the following steps but is not limited to the following steps, and can be adjusted according to actual production conditions:

[0027] 1) Fix the workpiece 5 on the fixture 6 of the driving shaft located in the polishing pool 1, and then fill the polishing pool 1 with the heat carrier 2;

[0028] 2) Start the heating medium circulation system, and use the temperature control device 12 to control the temperature of the heating medium 2, so as to adjust the stiffness of the thermorheological elastomer grinding head 4 to meet the process requirements;

[0029] 3) Adjust the fixture 6 and control the movement of the polishing spindle 3 at the same time, so that the thermo-rheological elastomer grinding head 4 and the workpiece 5 are ground against each other, and the deterministic removal of the materia...

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Abstract

The invention discloses a polishing method based on a heat rheological material. The polishing method comprises the steps that (1) a workpiece is mounted on a fixture of a drive shaft, a heat carrieris added into a polishing tank; (2) a heat carrier circulation system is started, the temperature of the heat carrier is adjusted to control the stiffness of a heat rheological elastomer grinding headto meet process requirements; (3) the fixture is adjusted, and the movement of a polishing main shaft is simultaneously controlled, the heat rheological elastomer grinding head is ground against theworkpiece, and the deterministic removal of a surface material of the workpiece is realized by the micro-cutting action of abrasive particles. The invention further provides a polishing device based on the heat rheological material. The polishing device mainly comprises a polishing main shaft, the heat rheological elastomer grinding head, the workpiece and the fixture, the heat carrier circulationsystem and the like. According to the polishing method and device based on the heat rheological material, the polishing medium stability is high, the material removal rate is high, a removal mold canbe controlled, the characteristic of variable stiffness is obtained, and the adaptability of the surface type is good; and the polishing method and device is suitable for high-efficiency and high-precision processing of complex profiles.

Description

technical field [0001] The invention relates to the field of precision and ultra-precision machining of complex curved surface parts, in particular to a polishing method and device based on thermo-rheological materials. Background technique [0002] Precision and ultra-precision machining are necessary means to obtain high shape accuracy, surface accuracy and surface integrity, among which polishing is a crucial step in determining the quality of the surface. With the increasing requirements for product quality and diversification, tiny size , Complex surface parts are more and more widely used in aviation, aerospace, national defense and high-tech civilian fields. These parts are small in size, and most of them are hard, brittle and difficult to process materials. They have high requirements on processing accuracy and reliability, and no surface damage is allowed. Or sub-surface damage, also requires the ability to produce efficiently and in batches, which poses a huge chal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B51/00B24B55/06B24D5/00B24D3/22B24D3/20
CPCB24B29/02B24B51/00B24B55/06B24D3/20B24D3/22B24D5/00
Inventor 徐志强王秋良吴衡易理银张高峰姜胜强朱科军
Owner XIANGTAN UNIV
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