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Device for dynamically monitoring ultra-precise machining toughness and brittleness removal of ceramic material

A technology of ultra-precision machining and ceramic materials, applied in stone processing tools, stone processing equipment, work accessories, etc., can solve the problems of wasting materials, consuming energy, and prolonging the test period.

Active Publication Date: 2019-07-23
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method has many disadvantages such as wasting materials, consuming energy, and prolonging the test period.

Method used

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  • Device for dynamically monitoring ultra-precise machining toughness and brittleness removal of ceramic material
  • Device for dynamically monitoring ultra-precise machining toughness and brittleness removal of ceramic material
  • Device for dynamically monitoring ultra-precise machining toughness and brittleness removal of ceramic material

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing and specific embodiment its technical scheme is further elaborated

[0025] Such as figure 1 Shown is a structural schematic diagram of a ceramic material ultra-precision machining, data acquisition, and feedback integrated prototype of the present invention. The integrated prototype includes an ultra-precision machining system, a cooling system, a data acquisition system, a logic judgment system, and processing speed and depth. Control System.

[0026] The ultra-precision machining system is used for ultra-precision machining of ceramic materials, and is mainly composed of lathes, cutting tools and ceramic workpieces.

[0027] The cooling system is composed of cooling liquid, cooling liquid sprayer and cooling liquid recovery tank, and is used to eliminate the influence of processing heat on the workpiece.

[0028] The data acquisition system is used to collect and record data on the surface area of ​​the ultra-precisio...

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Abstract

The invention discloses a device for dynamically monitoring an ultra-precise machining toughness and brittleness removal of ceramic material. The device adopts a micro-nano imager to calculate the surface area of a workpiece in the ultra-precise machining process, the qualitative relation of the microstructure evolution and the surface area variation trend is adopted to predict that the ceramic material is subjected to ultra-precision machining to be subjected to toughness removal or brittle removal. Therefore, by changing the ultra-precise machining speed, the toughness is removed, the sub-surface damage is reduced, and the surface integrity is improved. The device can simply, conveniently and quickly judge a material removal mechanism in the ultra-precise machining process of brittle materials, the complexity and the difficulty caused by the fact that a complex in-situ scanning electron microscope or transmission electron microscope is used for judging the material removal mechanismby observing the evolution of the microstructure are avoided, and meanwhile, manpower and material resources are saved, and the material waste is avoided.

Description

technical field [0001] The invention relates to a device for dynamically monitoring ultra-precision machining of ceramic materials and adjusting and removing methods, in particular to a prototype integrated with ultra-precision machining, data collection and feedback Background technique [0002] Due to their superior physical and mechanical properties, ceramic materials have been widely used in the fields of machinery, electronics, aerospace, national defense, bionic devices, and robots. However, with the development of mechanical products in the direction of "high, precise and sharp", the performance requirements of ceramic devices are becoming more and more stringent, such as high surface integrity and low subsurface damage. At the same time, the hard and brittle nature of the ceramic material makes it inevitable to produce processing damage and cracks in the process of processing, which reduces its reliability. How to effectively reduce the damage during the processing ...

Claims

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Application Information

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IPC IPC(8): B28D1/16B28D7/00B28D7/02
CPCB28D1/16B28D7/005B28D7/02
Inventor 李甲方棋洪田圆圆易明
Owner HUNAN UNIV
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