Conductive silver paste for Low-temperature sintered LTCC

Abstract

The invention discloses conductive silver paste for low-temperature sintered LTCC. The conductive silver paste comprises 80.0-88.0wt% of silver powder, 0.2-5.0wt% of glass powder and 7.0-19.8wt% of organic carrier, wherein the silver powder comprises nanometer silver powder, microcrystal-shaped silver powder and sheet-shaped silver powder, the weight ratio of the nanometer silver powder and the microcrystal-shaped silver powder is (2.5-3.0):1, the weight ratio of the nanometer silver powder and the microcrystal-shaped silver powder and the sheet-shaped silver powder is (7.0-10):1, and the glass powder comprises Bi2O3, ZnO, SiO2, H3BO3, Al2O3, MgO, La2O3 and Nd2O3. The conductive paste does not contain lead and has excellent performance, the sintering temperature is 600-650 DEG C, the sintered LTCC product has excellent adhesion and favorable silver layer compactness, and the problem that Dupont paste and seld-made LTCC ceramic material sintering are not matched is solved.

Description

technical field [0001] The invention relates to the technical field of LTCC, in particular to a conductive silver paste for low-temperature sintering of LTCC. Background technique [0002] With the development of electronic communication technology, especially the rapid promotion of 5G communication technology in recent years, electronic products must have the characteristics of miniaturization, multi-function, and high reliability. Low temperature co-fired ceramic technology (Low Temperature Co-fired Ceramic, LTCC) is an integrated component technology, because of its excellent electronic and thermomechanical properties, it has become the first choice for the integration and modularization of electronic components in the future. At present, the application fields of LTCC technology involve LED packaging, mobile communication, automotive electronics, medical electronics, aerospace and military electronics, etc. [0003] In the application process of LTCC technology, it is n...

AI Technical Summary

Problems solved by technology

Due to the obvious gap between LTCC green tapes and foreign manufacturers, the LTCC green tapes used in my country are basically monopolized by international manufacturers such as Ferro and Dupont, and the corresponding electrode pastes are basically used by green tape suppliers. control, which leads to the high cost of finished products of LTCC devices developed and produced in my country, and more importantly, the core key technologies are subject to human control.

In recent years, the country's requirements for localization in the field of electronic components have become more and more urgent. Some domestic manufacturers have gradually developed their own LTCC raw ceramic tapes, but there is still a large gap with foreign manufacturers in the development of electrode paste. The key technologies of basic materials such as glass powder, silver powder and organic vehicle required for LTCC conductive paste have not been fully grasped

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