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A masking tape cutting method based on separate tooling

A separate and tooling technology, which is applied in the manufacture of printed circuits, electrical components, and printed circuits, can solve the problems of discontinuous step sawtooth, difficult masking tape cutting, and discontinuous rounded corners, so as to improve cutting efficiency and save The effect of labor cost and loss reduction

Active Publication Date: 2022-04-19
DFINE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a masking tape cutting method based on separate tooling, which cuts the masking tape based on the separate tooling, and forms a smooth arc with a radius of 5mm by forming the irregular edge of the separate tooling to solve the separation process. The problem of the discontinuity of the stepped sawtooth or the inset of the rounded corners, so that it is convenient to cut the masking band to improve the cutting efficiency
[0006] In the process of tooling separation design in the present invention, the actual PCB has a step-like sawtooth irregular shape. This shape has problems such as discontinuity or rounded corners embedded. It is difficult to cut the masking tape when cutting by hand. The edge forms a smooth chamfering pattern; by smoothing the irregular edge of the separate tooling and then cutting the masking tape, the irregular edge of the separate tooling forms a smooth arc with a radius of 5mm, which is convenient for manual cutting. , which improves the cutting efficiency of the masking tape; on the other hand, it can ensure the masking effect of the masking tape cut by the separate tooling on the PCB mounting board

Method used

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  • A masking tape cutting method based on separate tooling
  • A masking tape cutting method based on separate tooling
  • A masking tape cutting method based on separate tooling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A masking tape cutting method based on separate tooling, such as figure 1 , figure 2 As shown, the irregular edge of the separate tooling is smoothed, and the irregular edge of the separate tooling forms a smooth arc with a radius of 5mm.

[0026] In the process of tooling separation design in the present invention, the actual PCB has a step-like sawtooth irregular shape, which has problems such as discontinuity or rounded corners embedded, and it is difficult to cut the masking tape when cutting by hand. The edge forms a smooth chamfering pattern; by smoothing the irregular edge of the separate tooling and then cutting the masking tape, the irregular edge of the separate tooling forms a smooth arc with a radius of 5mm, which is convenient for manual cutting. , which improves the cutting efficiency of the masking tape; on the other hand, it can ensure the masking effect of the masking tape cut by the separate tooling on the PCB mounting board.

Embodiment 2

[0028] This embodiment is further optimized on the basis of embodiment 1, as figure 1 As shown, when the length at the edge is greater than 5mm, use a chamfering radius of 5mm for chamfering; as figure 2 As shown, when the length at the edge is less than 5mm, the edge length is compensated to 5mm, and then the chamfering radius is 5mm for chamfering.

[0029] The invention can handle separate tooling with different edge lengths. The smooth chamfering of the separate tooling ensures the smoothness of manual cutting and reduces the loss of the area of ​​the separate tooling. The loss of area makes the masking effect of the masking tape on the PCB mounting board reach the target, so as to achieve the normal cutting level. The invention improves the work efficiency, reduces the loss in the cutting process, saves the labor cost, and has better practicability.

[0030] Other parts of this embodiment are the same as those of Embodiment 1, so details are not repeated here.

Embodiment 3

[0032] A masking tape cutting method based on separate tooling, such as Figure 5 shown, including the following steps:

[0033] Step 1: Draw a drawing of the separate tooling;

[0034](1) Draw a drawing of the separate tooling according to the shielding part of the PCB mounting board;

[0035] (2) Chamfer the edge of the separate tooling in the drawing: as figure 1 As shown, firstly, the edge of the separate tooling larger than 5mm in the drawing is chamfered for the first time with a radius of 5mm, so that the edge of the separate tooling larger than 5mm forms an arc with a radius of 5mm; figure 2 As shown, then the edge of the separate tooling less than 5mm in the drawing is compensated to 5mm; finally, the second chamfering with a radius of 5mm is performed on the edge after the compensation of the separate tooling in the drawing.

[0036] Step 2: Prepare separate tooling;

[0037] (1) Choose an aluminum plate with a thickness of 1mm-1.5mm as the preparation material ...

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Abstract

The invention discloses a masking tape cutting method based on separate tooling, which belongs to the technical field of masking tape cutting. The irregular edges of the separate tooling are smoothed, and the irregular edges of the separate tooling form a smooth arc with a radius of 5 mm. The present invention cuts the masking strip based on the separate tooling, and forms a smooth circular arc with a radius of 5mm on the irregular edge of the separate tooling to solve the problem of discontinuity or embedded rounded corners of the stepped sawtooth during the separation process, thereby Convenient cropping masking tape to improve cutting efficiency.

Description

technical field [0001] The invention belongs to the technical field of masking tape cutting, and in particular relates to a masking tape cutting method based on separate tooling. Background technique [0002] After the assembly test is completed, the PCB mounting board needs to be treated with three defenses, and the three defenses are generally treated by spraying. For the part of the printed board that does not need three defenses, masking protection is required. For the masking before three defenses, the industry generally uses TESA masking tape for masking. The masking tape is generally of regular length (3mm-60mm width). , but the masking of irregular printed boards needs to be customized separately. If the purchase batch does not reach a certain scale, it is difficult for the masking tape manufacturer to produce alone. For a certain batch of products, the manufacturer can only trim the masking tape manually, which requires a lot of manpower and time. There is also a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
CPCH05K3/281
Inventor 潘永徐克兴
Owner DFINE TECH
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