Picosecond laser galvanometer equipment with same light source and double galvanometers

Abstract

The invention discloses picosecond laser galvanometer equipment with a same light source and double galvanometers. The equipment comprises a rack, a marble base, a power distribution cabinet, a control system, a display system, a door control mechanism, an outer cover assembly, a vacuum generator, a vacuum adsorption system, an XYZ axis moving system, a laser device, an optical path integration, the galvanometers and a telecentric variable focusing lens. The marble base is composed of a base, a vertical base and a top base, and sequentially provided with a Y-axis moving system, an X-axis moving system, two Z-axis moving systems and a vacuum adsorption system, the telecentric variable focusing lens and the galvanometers are coaxially mounted, the distances between the axes are consistent, and the laser device is the picosecond grade laser generation device. Product quality consistency is ensured by adopting the same light source, the marble base is of an integrated structure, high-precision curve cutting, punching, grooving and edging are realized by matching the galvanometers with the telecentric variable focusing lens, processing precision, product quality and production efficiency are improved, the process adaptability is good, and the practical effect is remarkable.

Description

technical field [0001] The invention relates to a laser processing equipment, in particular to a picosecond laser vibrating mirror precision equipment, and mainly relates to the technical field of precision cutting equipment for cutting glass. Background technique [0002] At present, glass products are used in all aspects of daily life and are in great demand. Corresponding cutting of different glass materials also has a large market demand. [0003] With the development of technology, the cutting methods of glass are also constantly updated. At present, laser cutting is the main method, which has many advantages compared with traditional mechanical cutting methods, mainly including fusion cutting, stress cutting (crack control method), There are several cutting methods such as ablative (ablation) cutting. (1) The laser power required by the fusion cutting method is high, the cutting size is difficult to control precisely, the cutting surface is rough, and the processing ...

AI Technical Summary

Problems solved by technology

(1) The laser power required by the fusion cutting method is high, the cutting size is difficult to control precisely, the cutting surface is rough, and the processing quality needs to be improved

(2) The stress cutting method cannot solve the problem of curved surface and special-shaped cutting

(3) The cutting speed of laser ablation (ablation) is relatively slow, and the processing efficiency is not high

The existing laser equipment for cutting glass has a single structure of marble base, which cannot meet the requirements of strength and stability; at the same time, the galvanometer system is usually installed on a moving Y or Z-axis motion platform, which cannot fully meet the needs of glass cutting. High-precision requirements in terms of contour, cutting accuracy, processing efficiency, cutting cracks, cutting strength, process adaptability, etc., have great limitations

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