Throughput flexible intelligent assembly logistics path planning method

A path planning and logistics technology, which is applied in the field of throughput flexible intelligent assembly logistics path planning, and can solve problems such as being unsuitable for direct simulation.

Active Publication Date: 2019-08-02
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, existing methods and tools for Holonic Manufacturing Systems (HMS) are not suitable for direct simulation, considering the related planning issues and ease of use in industrial applications

Method used

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  • Throughput flexible intelligent assembly logistics path planning method
  • Throughput flexible intelligent assembly logistics path planning method
  • Throughput flexible intelligent assembly logistics path planning method

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Experimental program
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Embodiment Construction

[0088] As shown in all the figures, the present invention relates to an optimal planning method for logistics paths of flexible intelligent assembly. The method relies on planning platforms.

[0089] Under the constraints of the shortest path and the shortest time, the path planning of the present invention combines information such as the priority of use of parts, product assembly time complexity, and parallel evolutionary algorithms to realize dynamic combination path planning and maximize product assembly efficiency and production line equipment utilization efficiency .

[0090] The throughput flexible intelligent assembly logistics path planning platform involved in the present invention includes a sensor system, a production line system, a real-time logistics path intelligent control system, and communication facilities; combined with the enterprise, this time focuses on the simulation model of the automobile braking system as an example and conducts system variables Opt...

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Abstract

The invention relates to a throughput flexible intelligent assembly logistics path planning method. The method comprises the following steps that A, specific parameters of a final finished product areinput into an intelligent assembly logistics path planning platform; wherein the specific parameters comprise the number of finished products, the types of parts required for assembling the products,the number of the parts, the number of produced complete parts and the time required for assembling; B, the sensor system collects information of related products in real time and transmits the information to the processing unit; C, a planning platform processing unit searches a station for the next production process of the product P through data calculation; D, the product P is moved to the next station or to the buffer area of the current station; E, production flow production is performed at the station, and the current station state is transmitted to a processing unit in real time; F, ifproduction is not completed, the steps E to F are repeated; and step G, a finished product P is obtained after the production is completed.

Description

technical field [0001] The invention relates to a logistics path planning method for throughput flexible intelligent assembly. Background technique [0002] Governments of all countries have realized the importance of information and communication technology in industrial production, and have launched corresponding programs to strive to complete industrial digitalization and intelligent upgrades first, such as the Industrial Internet (IndustrialInternet) and the Advanced Manufacturing Partnership (AMP) proposed by the United States. Plan, Germany's Industry 4.0 (Industie 4.0) and France's new industrial France (La Nouvelle France Industrielle) plan, etc. [0003] The rapid development of technologies such as semantic big data, cloud computing, and grid computing provides a broad space for the widespread use of information and communication technology (ICT) in smart industries. The CPS system was identified as a key research area by the National Science Foundation (NSF) in 2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/04G06Q50/04G06N3/12
CPCG06Q10/047G06Q50/04G06N3/126Y02P90/30
Inventor 李庆党孙振张岩
Owner QINGDAO UNIV OF SCI & TECH
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