Electromagnetic band gap power layer structure applied to high speed packaging system
A packaging system and electromagnetic bandgap technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, circuit devices, printed circuit components, etc., can solve problems such as inability to satisfy broadband deep SSN suppression, achieve simple structure and improve performance , Design novel effects
Pending Publication Date: 2019-08-02
海宁利伊电子科技有限公司
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] There are various planar EBG structures for suppressing SSN, but they still cannot satisfy the deep SSN suppression of wideband in the high frequency range.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0054] A 2*2 array EBG structure with a size of 50mm*50mm*0.47mm is designed as the electromagnetic bandgap power plane, and the ground plane is a continuous and complete metal surface. The dielectric material of ordinary epoxy board FR-4 is used between the power plane and the ground plane. The loss tangent of this material is 0.02 and the dielectric constant is 4.4. The metal surface adopts copper foil with a thickness of 0.035mm, and its conductivity is 5.8E+0.07S / m. The coordinate origin is set at the lower left corner of the whole structure, the input port adopts 50 ohm standard coaxial excitation, the input port 1 is set at (12.5mm, 12.5mm, 0mm), and the output port 2 is set at (12.5mm, 37.5mm, 0mm ), the output port 3 is set at the position of (37.5mm, 37.5mm, 0mm).
[0055] In this embodiment, the shape of the power plane is square, its material is copper, and its size is 50mm×50mm×1oz (0.035mm). It consists of four electromagnetic bandgap units. The four electromag...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses an electromagnetic band gap power layer structure applied to a high speed packaging system. The structure includes a power layer, a medium substrate layer and a ground layer, wherein the power layer is etched with an EBG structure, the EBG structure includes four EBG basic units which are symmetrically arranged around the circumference in a square shape, for each basic unit, four corners of surrounding edges of a square patch are connected with inner edges of the square frame-like patch through respective inner branch structures, the square frame patch has an outer branch structure connected with the outer edge, the outer edge of the square frame-like patch is connected with the branch structure, each EBG basic unit is connected with the adjacent EBG basic unit through a connection branch structure, the connection branch structure is mainly composed of mirror-symmetrical 2-shaped and 5-shaped metal pieces. The structure is advantaged in that depth SSN suppression of a broadband in the high frequency range can be met, the electromagnetic layer structure is novel in design and simple in structure and can be directly applied to design of the power ground plane,and no additional size for the printed circuit board is added.
Description
technical field [0001] The present invention relates to the technical field of electromagnetic wave propagation and reception, in particular to a novel electromagnetic bandgap ( Electromagnetic Bandgap, EBG) power layer structure design. Background technique [0002] With the development of integrated circuits, it is very meaningful for circuit design to design a power / ground plane that can suppress electromagnetic interference. However, with factors such as high-speed digital circuits, high-speed signal processing, and the integration of radio frequency circuits and digital circuits, the design of the new power / ground plane should have a very wide bandwidth and strong attenuation in the forbidden band. Because the power / ground plane loaded with EBG structure has the advantages of wide bandgap bandwidth, simple implementation process, deep bandgap depth, and low cost, it is used as an effective means to suppress electromagnetic interference between two points on the power / g...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0218H05K1/0236
Inventor 李尔平左盼盼
Owner 海宁利伊电子科技有限公司