Dual optical path laser processing device and method for wafer scribing

Abstract

The invention relates to a dual optical path laser processing device and method for wafer scribing. The dual optical path laser processing device comprises a laser device and a dual optical path assembly, the dual optical path assembly comprises an optical gate A, an optical gate B, a beam expanding mirror, a polarizing spectroscope, and a half wavelength plate; lasers generated by the laser device form an optical path A and an optical path B; the optical path A enters the beam expanding mirror after the optical path A is reflected by an optical path A reflecting mirror, and after the beam expanding mirror expands an optical beam, the optical path A enters the polarizing spectroscope after passing an optical path A reflecting mirror again; the optical path B reaches the half wavelength plate after the optical path B is reflected by an optical path B reflecting mirror, and B enters the polarizing spectroscope after is adjusted and after passing an optical path B reflecting mirror again;and the lasers emitted by the polarizing spectroscope are focused on a wafer to be processed. According to the dual optical path laser processing device and method for the wafer scribing, laser spotscan be dynamically adjusted of the deflected optical beam of the optical path A through the beam expanding mirror to meet the complex processing requirements, laser device energy can be dynamically adjusted after the optical beam deflected by the optical path B passes through the half wavelength plate, and thus the processing effect is ensured.

Description

technical field [0001] The invention relates to the technical field of wafer dicing processing, in particular to a dual-optical-path laser processing device and method for wafer dicing. Background technique [0002] The most critical technology for wafer processing is laser scribing technology. In recent years, due to the increasingly fierce competition in the industry, the efficiency and accuracy of scribing equipment are increasingly demanding. The cutting process has changed from the previous 30um to the current 10um. , The single-chip production capacity has increased by more than 50% compared with the previous one, the luminous brightness has increased by more than 20% compared with the previous one, and the chip size has been upgraded to a smaller 03*05mil. [0003] At the same time, due to the strong demand in the field of consumer electronics, it is increasing at a rate of more than 20% every year; as we all know, laser scribing equipment is the basis for the develop...

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Problems solved by technology

[0003] At the same time, due to the strong demand in the field of consumer electronics, it is increasing at a rate of more than 20% every year; as we all know, laser scribing equipment is the basis for the development of the wafer industry in the field of consumer electronics. The degree of precision is inseparable. The fully automatic laser processing device based on wafer scribing is a particularly important link in the wafer manufacturing process. At present, wafer scribing mainly relies on a single optical path to act on the wafer, and applies it through a single optical path that emits different energies before and after. For the wafer, the efficiency is low, and the adjustment is complicated

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