SMT nanometer coating cleaning agent and use method thereof

Abstract

The invention discloses an SMT nanometer coating cleaning agent, which comprises anhydrous ethanol, fluorohydrocarbon modified polysiloxane and methylal. According to the present invention, the nanometer coating cleaning agent can greatly improve the solder paste demolding quality of a mesh plate, such that the solder paste molding effect is excellent, and in the case of no increase of the wipingfrequency of the mesh plate even reducing of the wiping frequency of the mesh plate, the bad phenomena of less tin paste demolding tin, tin connecting on the pin and the like can be well improved while the consumption of the mesh plate wiping paper can be reduced; the SMT nanometer coating cleaning agent can ensure the tin paste demolding and molding quality of the ultra-fine tin paste printing inelectronic industry, and improve the production efficiency of the industry; and the product is firstly developed in the electronics industry, and belongs to the technological innovation in electronics industry.

Description

technical field [0001] The invention relates to a nano cleaning agent for solder paste demoulding in the SMT industry, in particular to an SMT nano coating cleaning agent and a use method thereof. Background technique [0002] In the rapidly developing electronics industry, the volume of electronic components is getting smaller and smaller, and the degree of integration is getting higher and higher. Chip components have developed from the original 0805,0603 to 0201,01005 or even smaller; the pin spacing of IC chips has also changed from the original The development of 0.5PITCH to 0.4, 0.3, and even 0.2PITCH puts forward higher requirements for the traditional PCB solder paste printing process. [0003] The traditional solder paste printing process tends to often produce bad phenomena such as less printed tin, pins connected to tin, and solder paste stripping. The production factory can only improve these bad phenomena by increasing the frequency of cleaning and wiping the so...

AI Technical Summary

Problems solved by technology

[0003] The traditional solder paste printing process tends to often produce bad phenomena such as less printed tin, pins connected to tin, and solder paste stripping. The production factory can only improve these bad phenomena by increasing the frequency of cleaning and wiping the solder paste stencil. These unfavorable phenomena cannot be completely overcome. The production process requires that the frequency of cleaning and wiping the solder paste stencil will be reduced from the original 5pcs to wipe the stencil once for production of 2pcs, and the production quality will be improved by giving up production efficiency.