200results about "Fluorine-based surface-active compounds" patented technology

This invention relates to a “high lower alcohol content” (>40% v / v of a C1-4 alcohol) liquid composition able to be either dispensed as a stable foam with the use of non-propellant foam dispensing devices from non-pressurized containers or as an alcohol gel composition which does not use thickener and gelling agents that leave undesirable deposits or a sticky after-feel and that has a final viscosity less than 4,000 cps. The liquid compositions comprise an alcohol, C1-4 (>40% v / v), a fluorosurfactant of at least 0.001% by weight to prepare a foamable composition or from 0-2.0% to prepare a gel-like composition of a final viscosity less than 4,000 cps, 0-10% w / w of additional minor components added to obtain the desired performance (a foamable composition or a gel-like composition with a viscosity less than 4,000 cps), and the balance being purified water. The compositions may include emulsifier-emollients and mosturizers, secondary surfactants, foam stabilizers, fragrances, antimicrobial agents, other type of medicinal ingredients, and the like ingredients or additives or combinations thereof commonly added to alcohol gels or foams, aerosol compositions or to toiletries, cosmetics, pharmaceuticals and the like.

Described are fluorochemical surfactants derived from nonafluorobutanesulfonyl fluoride that contain polyalkyleneoxy side chains and may be copolymerized with acrylic acid or methacrylic acid to form polyacrylates or polymethacrylates. The surfactants surprisingly lower the surface tension of water and other liquids in the same or similar low values achieved by premier surfactants such as those derived from perfluorooctane sulfonyl fluoride.

The present invention relates to associative complexes of water soluble and / or water dispersible polymers and polymeric fluorosurfactants, compositions and methods for modifying substrates to provide treated articles with surface protective properties including easier cleaning, increased stain and / or soil repellency, and increased resistance to bio-fouling and environmental contamination.

This invention provides for an enzymatic cleaning composition that will reduce and remove allergens and perform general cleaning at the same time. The enzymatic cleaning composition comprises an enzyme and / or a bacterial spore substance capable of producing enzymes, a wetting agent, an odor-encapsulating agent, a neutralizing agent, a surfactant-encapsulating agent, an embrittling agent and water. The enzymatic composition is applied to carpets, upholstery, drapes and other fabrics, and hard surfaces. The applied composition dries and subsequently the allergens can be removed. Additionally, the present invention provides for a new and unique manner of delivery of the enzymatic composition.

Described are fluorochemical surfactants derived from nonafluorobutanesulfonyl fluoride that contain polyalkyleneoxy side chains and may be copolymerized with acrylic acid or methacrylic acid to form polyacrylates or polymethacrylates. The surfactants surprisingly lower the surface tension of water and other liquids in the same or similar low values achieved by premier surfactants such as those derived from perfluorooctane sulfonyl fluoride.

This invention relates to compositions containing lower (C1-C4) alcohol and a polymeric fluorosurfactant formulated for being dispensed as a foam product. More particularly, the invention relates to improved compositions formulated with polymeric fluorosurfactants with pendant perfluoroalkyl side chains of a fully fluorinated chain length of C1-C7. The compositions also relate to use for personal care, such as skin sanitizing and cleansing.

A cleaning composition for cleaning particulate contamination from small dimensions on microelectronic device substrates. The cleaning composition contains dense CO2 (preferably supercritical CO2 (SCCO2)), alcohol, fluoride source, anionic surfactant source, non-ionic surfactant source, and optionally, hydroxyl additive. Such cleaning composition overcomes the intrinsic deficiency of SCCO2 as a cleaning reagent, viz., the non-polar character of SCCO2 and its associated inability to solubilize species such as inorganic salts and polar organic compounds that are present in particulate contamination on wafer substrates and that must be removed from the microelectronic device substrate for efficient cleaning. The cleaning composition enables damage-free, residue-free cleaning of substrates having particulate contamination on Si / SiO2 substrates.

A rinse agent composition is provided. The rinse agent composition includes a sheeting agent for promoting draining of sheets of water from a surface, and a humectant. The humectant is a component which retains at least 5 wt.% water when the humectant has been contained at an equilibrium of 50% relative humidity and room temperature. The sheeting agent and humectant are preferably provided at a ratio of between about 5:1 and about 1:3. A method for rinsing a substrate surface in the presence of high solids containing water is provided. High solids containing water is generally considered to be water having a total dissolved solids content in excess of 200 ppm.

Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and / or reuse of said structure.

The invention provides a detergent, useful for removal of pigment-dispersive photosensitive resin. Compared with previous products, the detergent of the invention develops cleaning effect with less amount and is difficult to arouse aggregation and sinking of detergent. The said detergent is characteristic in that it contains more than two of aromatic compounds having at least one alkyl, wherin the total number of carbon atoms of all alkyl groups is 3-5.

It is to provide a compound which has a low vapor pressure and low viscosity, which is less problematic in deterioration during its use and which is useful as e.g. a lubricant, a surface modifier or a surfactant. A fluoropolyether compound represented by the formula (X—)xY(-Z)z, wherein X is a group represented by the formula HO—(CH2CH2O)a.(CH2CH(OH) CH2O)b—(CH2)c—CF2O(CF2CF2O)d— (wherein “a” is an integer of from 0 to 100, b is an integer of from 0 to 100, c is an integer of from 1 to 100, and d is an integer of from 1 to 200), Z is a group represented by the formula RFO(CF2CF2O)g— (wherein RF is e.g. a C120 perfluoroalkyl group having an etheric oxygen atom inserted between carbon-carbon atoms, and g is an integer of from 3 to 200), Y is e.g. a (x+z) valent perfluorinated saturated hydrocarbon group, x is an integer of at least 2, z is an integer of at least 0, and (x+z) is an integer of from 3 to 20.

Disclosed are compositions comprising unsaturated hydrofluorocarbons, an alkene with the formula of 1,1,1,4,4,5,5,6,6,6-decafluorohex-2-ene and its isomers (the “153-10 isomers”). The invention further relates to use of said compositions in methods to clean, degrease, deflux, dewater, deposit fluorolubricant, carrier fluid applications and heat transfer applications. The invention further relates to novel 153-10 isomer mixtures, their method of making and their use as cleaning compositions and in the methods listed above.

Fluoroalkyl phosphates containing a tertiary carbon and a nonfluorinated chain are useful as surfactants and additives. The f can be used to alter a surface property of a medium and to provide resistance to blocking, open time extension, or oil repellency to a substrate.

Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One composition of such type, having utility for removing flux and solder perform surface films, includes supercritical fluid, e.g., supercritical CO2, and organic co-solvent, e.g., xylene. Another composition of such type having utility for removal of metals, metal oxides, metal-containing post-etch residues and CMP particles from semiconductor substrates includes supercritical fluid and at least one β-diketone.

There is provided a washing liquid composition for a semiconductor substrate having a contact angle between the surface thereof and water dropped thereon of at least 70 degrees, the washing liquid composition including an aliphatic polycarboxylic acid and a surfactant, and the washing liquid composition having a contact angle of at most 50 degrees when dropped on the semiconductor substrate. It is thereby possible to effectively remove particles and metals on the surface of a hydrophobic substrate without corroding it.

A chemical cleaning composition for cleaning electronic equipment and electric or electronic appliances, a device for the application of such composition, and a method of cleaning such equipment are disclosed.

The present invention relates to adhesion promoting cleaner compositions which comprise at least one acid having at least one sulphur atom and a pKa of less than 2, and also at least one wetting assistant and water. These adhesion promoting cleaner compositions promote the adhesion of adhesives and sealants to paints.

The invention is a cleaning solution for degreasing metal articles which contains water soluble, N-alkyl substituted amides in which the alkyl substituent has from 6 to 22 carbon atoms and at least one of (i) amine oxide surfactants, (ii) non-ionic water soluble nonionic surfactants with molecules containing a polyoxyalkylene block, and (iii) alkali stable anionic, or both anionic and amphoteric, surfactants. Preferred compositions of the invention can replace a vapor degreasing process for cleaning oil, grease, and waxy-type contaminants from metal articles to the level of cleanliness required in the aerospace industry.

A compound comprising Formula I, or a mixture thereof,whereinY is a bond or CmH2m−p(OA)p wherein m is 0 to 4, and p is 0 or 1,X′ is X or H,X is CH2CH2OA, CH(CH2OA)2, C(CH2OA)3, orX and X′ combine to form (CH2CH2)2NCH2CH2OA or (CH2CH2)2O, provided that when X and X′ combine to form (CH2CH2)2O then Y is CH2CH(OA)CH2,A is CF2CFHO—Rf or H,Rf is CnF2n+1 wherein n is an integer of 1 to about 6,M is a cation having a charge equal to a, anda is a positive integer equal to 1 or 2,provided that at least one of X, X′, or Y contains A equal to CF2CFHO—Rf,and its use in lowering surface tension and imparting improved surface effects.

Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.

A compound of Formula 1Rf-A-OP(O)(O−M+)(O—RH)   Formula 1whereinRf is a C2 to C6 linear or branched perfluoroalkyl optionally interrupted by one, two or three ether oxygen atoms;A is (CH2CF2)m(CH2)n—, (CH2)oSO2N(CH3)(CH2)p—, O(CF2)q(CH2)r—, or OCHFCF2OE-;m is 1 to 4; n, o, p, and r are each independently 2 to 20; q is 2;E is a C2 to C20 linear or branched alkyl group optionally interrupted by oxygen, sulfur, or nitrogen atoms; a cyclic alkyl group, or a C6 to C10 aryl group;M is a Group I metal or an ammonium cation (NHxR2y)+ wherein R2 is a C1 to C4 alkyl, x is 1 to 4, y is 0 to 3 and x+y is 4; andRH is a C1 to C20 linear, branched, or cyclic alkyl, or a C6 to C10 aryl, and its use as a surfactant is disclosed.

A reverse emulsion-based slick water concentration system, wherein the reverse emulsion is obtained by dispersing an aqueous phase A to an oil phase B under mechanical agitation; wherein the aqueous phase A is composed of a water-soluble monomer A1, a water-soluble fluorocarbon surfactant A2, a water-soluble quaternary ammonium clay stabilizer A3 and water A4; wherein the oil phase B comprises an oil-soluble dispersant / surfactant Bi, an oil-soluble radical initiator B2 and a hydrophobic solvent B3 as a dispersing medium; wherein, the percentages of each component described above, relative to the total weight of the reaction system is as the following: water-soluble monomer A1: 5.0-30.0%; water-soluble fluorocarbon surfactant A2: 0.1-5.0%; water-soluble quaternary ammonium clay stabilizer A3: 0.1-15.0%; water A4: 5.0-35.0%; oil-soluble dispersant / surfactant B1: 0.1-5.0%; oil-soluble radical initiator B2: 0.000001-0.100%; hydrophobic solvent B3: remainder.

The present invention comprises a compound comprising Formula 1A, 1B, or 1C(Ra—O—CO—)2X  Formula 1ARa—O—CO—X—CO—O—(CH2CH2)Rf  Formula 1BRa—O—CO—X—CO—O—R  Formula 1CwhereinRa is the group Rf(CH2CF2)d—(CgH2g)—; RfOCF2CF2—(CgH2g)—; RfOCFHCF2O(CH2CH2O)v—(CgH2g)—; RfOCFHCF2O(CwH2w); RfOCF(CF3)CONH—(CgH2g); or Rf(CH2)h[(CF2CF2)i(CH2CH2)j]k;Rf is CcF(2c+1);d is 1 to about 3; g is 1 to 4; v is 1 to about 4; w is from about 3 to about 12; h is 1 to about 6; i, j, and k are each independently 1, 2, or 3, or a mixture thereof; provided that the total number of carbon atoms in group (vi) is from about 8 to about 22;X is a linear or branched difunctional alkyl sulfonate group —CeH(2e−1)(SO3M)-, wherein e is 2 or 3;M is a monovalent cation selected from the group consisting of hydrogen, ammonium, alkali metal, or alkaline earth metal;R is H or a linear or branched alkyl group CbH(2b+1)—; andb is from 1 to about 18.