A pcb rogowski coil for measuring the chip current of crimping igbt module
A technology of Rogowski coils and measuring coils, which is applied in the directions of measuring current/voltage, measuring electrical variables, transformer/inductor coils/windings/connections, etc. It can solve the problem of only measuring distribution at the edge, chip current cannot be measured, and increasing current Measurement cost and other issues, to achieve the effect of ensuring the accuracy of current measurement, facilitating research, and eliminating electromagnetic interference
A technology of Rogowski coils and measuring coils, which is applied in the directions of measuring current/voltage, measuring electrical variables, transformer/inductor coils/windings/connections, etc. It can solve the problem of only measuring distribution at the edge, chip current cannot be measured, and increasing current Measurement cost and other issues, to achieve the effect of ensuring the accuracy of current measurement, facilitating research, and eliminating electromagnetic interference
CN110133354BActive Publication Date: 2020-07-10HUAZHONG UNIV OF SCI & TECH
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[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0029] The collector molybdenum sheet, IGBT chip, emitter molybdenum sheet, silver sheet boss and plastic fixing frame in the crimping IGBT module are collectively referred to as sub-modules as a subunit. figure 1 A cross-sectional view of two sub-modules of a crimped IGBT module is shown. The upper and lower layers of molybdenum sheets can maintain uniform contact pressure on both sides and reduce the thermal expansion of the IGBT chip at high temperature, and as a good conductor of electricity and heat, it can conduct current and device loss well. The buffer silver sheet can well alleviate the t...
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Abstract
The invention discloses a PCB Rogowski coil for measuring a chip current of a pressure-welding IGBT module. The PCB Rogowski coil comprises a circular PCB base plate, boss penetrating holes and measuring coils, the multiple boss penetrating holes are distributed on the circular PCB base plate, distribution positions and sizes correspond to boss structures in the pressure-welding IGBT module, the measuring coils form multi-turn coil structures uniformly distributed around the boss penetrating holes through upper and lower routings and through holes of the circular PCB base plate, the PCB Rogowski coil is embedded between the boss structures in the pressure-welding IGBT module and superposed on a grid electrode routing PCB in the pressure-welding IGBT module, and when a changing current flows through a boss branch circuit, an induction potential is generated at the corresponding measuring coil, and the current change of the boss branch circuit is obtained through integral conversion of the induction potential. According to the PCB Rogowski coil, the current of the branch circuit at any position can be measured, the measuring precision of the current is improved, the operation is simple, and the current measuring cost of the parallel-connected branch circuits of the pressure-welding IGBT module is greatly reduced.
Description
technical field [0001] The invention belongs to the technical field of current measurement, and more specifically relates to a PCB Rogowski coil for measuring the current of a crimped IGBT module chip. Background technique [0002] The main packaging forms of high-power IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) modules are soldered package and crimped package. Compared with soldered package, the output power of crimped package module is higher, and the pressure The junction package has the advantages of double-sided heat dissipation and low parasitic inductance, and is more suitable for application in converter valves and circuit breakers. The distribution position and stress distribution of each chip in the crimping package module are inconsistent, so the parasitic inductance and contact resistance of each branch are different, resulting in different degrees of dispersion of current between chips. The branch with small parasitic inductance...
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Patent Timeline
10 Jul 2020
Publication
CN110133354B
- IPC
- G01R19/00; H01F27/28; H01F38/24
- CPC
- G01R19/00; H01F27/2804; H01F38/24
- Inventors
- 梁琳; 韩鲁斌