A thermally isolated high-frequency signal transmission structure in a directly modulated laser
A high-frequency signal and transmission structure technology, applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve the problems of increased current and power consumption of semiconductor refrigerators, reduce power consumption and current, and increase heat transfer thermal resistance , weaken the effect of heat conduction
Active Publication Date: 2021-05-04
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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This will increase the current and power consumption of the semiconductor cooler that controls the constant temperature of the laser chip to maintain the constant temperature of the laser chip
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[0019] The present invention will be further described below in conjunction with the accompanying drawings.
[0020] Because the gold wire and the gold layer on the surface of the transmission circuit chip are good conductors of heat, the thermal conductivity is very high, and the thermal resistance is small. Increasing this part of the thermal resistance can reduce the heat conduction between the constant temperature area and the non-constant temperature area, thereby reducing the current and power consumption of the semiconductor cooler in the constant temperature area.
[0021] As shown in 1 and 2, a heat-isolated high-frequency signal transmission structure in a directly modulated laser includes a first transmission circuit chip 1, a second transmission circuit chip 2, a capacitor, a laser chip, a semiconductor refrigerator, a constant temperature area and a non-conductive In the constant temperature area, the first transmission circuit sheet 1 and the second transmission ...
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The invention relates to the field of optoelectronic devices, and discloses a heat-isolated high-frequency signal transmission structure in a directly modulated laser. It includes a first transmission circuit sheet, a second transmission circuit sheet, a capacitor, a laser chip, a semiconductor refrigerator, a constant temperature area and a non-constant temperature area, and the first transmission circuit sheet and the second transmission circuit sheet are installed in the non-constant temperature area and the constant temperature area respectively. area, the two metal electrodes of the capacitor are installed on the first transmission circuit chip and the second transmission circuit chip respectively, the transmission line of the second transmission circuit chip is connected to the welding pad on the surface of the laser chip, and the constant temperature region and the non-constant temperature region The heat is transferred through the semiconductor refrigerator. In the present invention, the two metal electrodes of the capacitor are respectively installed in the constant temperature area and the non-constant temperature area, and the dielectric material between the metal electrodes can be a material with very low thermal conductivity, which weakens the heat conduction between the non-constant temperature area and the constant temperature area, thereby reducing Power consumption and current of a peltier cooler.
Description
technical field [0001] The invention relates to the field of optoelectronic devices, in particular to a heat-isolated high-frequency signal transmission structure in a directly modulated laser. Background technique [0002] In the field of optoelectronics, a directly modulated laser is a device that loads a microwave signal onto the laser and modulates the output optical signal of the laser. Directly modulated laser is a kind of chip that is very sensitive to temperature. When its temperature is too high or too low, the wavelength of the light wave generated by the chip will shift, which will have a great impact on its performance. Therefore, the temperature in the area where the laser is located must be stable. Normal temperature range. It can be realized by the semiconductor refrigerator under the laser (the semiconductor refrigerator can transfer the heat from one side to the other side when it is powered on, forming a cold end surface and a hot end surface), which will ...
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IPC IPC(8): H01S3/04H01S3/042H01S5/024
CPCH01S3/0405H01S5/02415
Inventor 张童童杜林秀景飞廖翔吕晓萌伍艺龙高阳余昌喜
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP