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High flame-retardant and high flexibility epoxy resin composition and preparation method thereof

An epoxy resin, high flame-retardant technology, applied in chemical instruments and methods, compounds of group 5/15 elements of the periodic table, organic chemistry, etc., can solve the problem of encapsulation and curing of electronic components resistant to cold and heat shock The material is brittle, the toughness is insufficient, etc., to achieve the effect of excellent flame retardant durability, improved moisture resistance, and reduced chemical resistance

Active Publication Date: 2019-08-23
TIANJIN RUI YUAN POWDER COATING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Epoxy resin is a thermosetting material with high crosslinking density. Due to its insufficient toughness, the cured material is brittle and easy to crack. It cannot be used for the packaging of electronic components that require high thermal shock resistance.

Method used

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  • High flame-retardant and high flexibility epoxy resin composition and preparation method thereof
  • High flame-retardant and high flexibility epoxy resin composition and preparation method thereof
  • High flame-retardant and high flexibility epoxy resin composition and preparation method thereof

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preparation example Construction

[0064] The preparation method of the above-mentioned highly flame-retardant high-flexibility epoxy resin composition, the steps are as follows:

[0065] Premix epoxy resin, self-made high flame retardant curing agent with heterocyclic structure, other curing agents, curing accelerators, flame retardant synergists and inorganic fillers according to the proportion by mass, and the premixing time is 3 to 10 minutes. Speed ​​600~1200r / min; melt extrusion mixing, extruder temperature 80~160℃, extruder speed 800~2400r / min, tablet cooling and crushing, crushing and sieving through ACM mill, that is, high flame retardant and high Flexible epoxy resin composition.

[0066] More specifically, the preparation method of the high flame-retardant and high-flexibility epoxy resin composition of the present invention provides two examples:

Embodiment 1

[0068] A preparation method of a highly flame-retardant and highly flexible epoxy resin composition, the steps are as follows:

[0069] Premix epoxy resin, self-made high flame retardant curing agent (A) with heterocyclic structure, other curing agents, curing accelerators, flame retardant synergists and inorganic fillers according to the ratio of parts by mass, and the premixing time 3~10min, speed 600~1200r / min; melt extrusion mixing, extruder temperature 80~160℃, extruder speed 800~2400r / min, tablet cooling and crushing, crushing and sieving through ACM mill, that is Obtain described epoxy resin composition.

[0070] Wherein, the synthetic method of the highly flame-retardant curing agent (A) with heterocyclic structure:

[0071] ⑴After sorting out the four-necked flask, agitator, distillation column, condenser tube and temperature-controlled heating mantle, add 210g of neopentyl glycol, raise the temperature to 120°C, heat and stir to melt; add 56.77g of 1,4-di-tert-butyl...

Embodiment 2

[0078] A preparation method of a highly flame-retardant and highly flexible epoxy resin composition, as follows:

[0079] Premix epoxy resin, self-made high flame retardant curing agent (B) with heterocyclic structure, other curing agents, curing accelerators, flame retardant synergists and inorganic fillers according to the ratio of parts by mass, and the premixing time 3~10min, speed 600~1200r / min; melt extrusion mixing, extruder temperature 80~160℃, extruder speed 800~2400r / min, tablet cooling and crushing, crushing and sieving through ACM mill, that is Obtain described epoxy resin composition.

[0080] Wherein, the synthetic method of the highly flame-retardant curing agent (B) with heterocyclic structure:

[0081] ⑴After sorting out the four-neck flask, stirrer, distillation column, condenser tube and temperature-controlled heating mantle, add 205g of neopentyl glycol, raise the temperature to 120°C, heat and stir to melt; add 71.12g of 1,4-di-tert-butyl -2,3,5,6-Tetrah...

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Abstract

The invention relates to a high flame-retardant and high flexibility epoxy resin composition. The constituent components and the mass parts of the composition are as follows: 20-40 parts of epoxy resin; 10-30 parts of a self-made high flame-retardant curing agent with a heterocyclic structure; 0-5 parts of other curing agents other than the self-made high flame-retardant curing agent with the heterocyclic structure; 0.02-0.5 part of a curing accelerator; 12-30 parts of a flame-retardant synergist; and 20-38 parts of an inorganic filler. The epoxy resin composition contains a special heterocyclic structure, a soft segment and a phosphine oxide structure, so that the epoxy resin composition can greatly improve the flame-retardant efficiency, the flame-retardant durability and the cold thermal shock resistance of an electronic packaging material after being used for the electronic packaging material, and the heat resistance, moisture resistance and chemical resistance of the electronic packaging material are all improved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, in particular to a highly flame-retardant and highly flexible epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin refers to a polymer containing two or more epoxy groups, with aliphatic, alicyclic or aromatic organic compounds as the backbone and formed by the reaction of epoxy groups; epoxy groups can be located in the molecular chain The end, middle or ring structure of the segment; it is one of the most widely used matrix resins in polymer matrix composites. Due to the special molecular structure of epoxy resin, epoxy resin has excellent adhesion, heat resistance, chemical resistance and excellent electrical insulation properties, and is easy to process, low shrinkage, small linear expansion coefficient and low cost. Advantages such as low cost. Widely used in the packaging of electronic components such as varistors, cera...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/42C08K3/22C08K3/24C08K3/38C07F9/6568
CPCC08G59/62C08G59/423C08G59/4284C08K3/22C08K3/24C08K3/38C07F9/65685C08K2003/387C08K2003/2227C08K2003/2224
Inventor 沈纪洋东继莲
Owner TIANJIN RUI YUAN POWDER COATING CO LTD
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