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Abrasives

A technology of abrasive grains and abrasive layers, used in abrasive tools, abrasives, metal processing equipment, etc., to solve the problems of reduced grinding rate, limited relaxation, and difficulty for abrasive materials to follow the surface shape, and to suppress the reduction of grinding rate and life. long effect

Active Publication Date: 2021-03-16
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a possibility that it may be difficult to perform uniform polishing due to the warpage of the base material.
Warpage of the substrate can be mitigated by increasing the average thickness of the substrate, but there is a limit to this relief
In addition, if the base material becomes thicker, the flexibility or ductility of the base material will decrease, and it will be difficult for the abrasive to follow the surface shape of the object to be ground.
Therefore, there is also the possibility that the grinding rate will decrease

Method used

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Examples

Experimental program
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Embodiment approach

[0104] The present invention is not limited to the embodiment, and various modifications and modifications can be implemented in the embodiment, in addition to the manner.

[0105] In the embodiment, the interval between the plurality of abrasive portions is set to the interval equal to the grinding portion within one row, but the interval between the line can also be between the grinding units within one line. The interval is different. For example, a plurality of abrasive portions can be configured as follows: a row of abrasive portions, and the two abrasive portions that are disposed adjacent to the abrasive portion and the two abrasive portions closest to the grinding portion constitute a positive triangle. Further, in the case where the interval between the line is set to different intervals between the grinding parts within one row, it is preferable to be 3 mm or more, 15 mm or less. If the interval between the line is less than the lower limit, the average area of ​​the top...

Embodiment 1

[0115] The "SINO CRYSTAL Diamond" "SINO CRYSTAL Diamond", the average particle diameter is 16 μm, as a filler alumina (Al 2 O 3 , Pacific Rundum Co., Ltd. "La4000", an average particle diameter of 4 μm, and an epoxy resin as a binder (JER828 "of Mitsubishi Chemical Co., Ltd.) is mixed and solidified The content of the diamond grinding grinding has become 3% by volume and the content of the filler into a manner of 75% by volume, and the coating liquid is obtained.

[0116] Preparing a substrate (average thickness 500 μm) as a primary component as a primary component as a substrate as a substrate, using the coating liquid on the surface of the substrate using printing. As the pattern of printing, a circular shape having a diameter of 3.9 mm is used in a top surface (an average area of ​​11.95 mm) with an area occupancy rate of 9%. 2 The opening portion, a metal-made mask having an average thickness of 350 μm. Furthermore, the opening portion is a staggered shape. Further, the amount...

Embodiment 2

[0118] The aluminum sheet (A1050, average thickness 300 μm) was prepared as a substrate, and the same coating liquid as in Example 1 was applied to the surface of the substrate using printing. As a pattern of printing, a square having a side of 2.6 mm (an average area of ​​6.76 mm) is used in a surface of 44% by area occupancy. 2 The opening portion, a metal-made mask having an average thickness of 350 μm. Furthermore, the opening portion is a staggered shape. Further, the amount of coating is adjusted in such a manner that the average thickness of the abrasive portion is 350 μm. The coating liquid was hardened using an oven for drying 120 ° C, 16 hours. The abrasive material of Example 2 was obtained in this manner.

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Abstract

An object of the present invention is to provide a polishing material capable of thickening a polishing portion while suppressing a reduction in a polishing rate. The abrasive material (1) of the present invention includes a substrate (10), and an abrasive layer (20) laminated on the surface side of the substrate (10) and containing abrasive grains (21) and a binder (22). A grinding material (1), the grinding layer (20) has a plurality of columnar grinding parts (20a), the plurality of grinding parts (20a) are arranged in a staggered manner, and the average thickness of the grinding parts (20a) is more than 300 μm , and the area of ​​the top surface of the grinding part (20a) is 6mm 2 As mentioned above, the average thickness of the substrate (10) is not less than 300 μm and not more than 3000 μm.

Description

Technical field [0001] The present invention relates to an abrasive material. Background technique [0002] For example, in the process of the glass substrate used in electronic devices such as hard disk (Hard Disk), a abrasive material for fixing particles is usually used. As such a abrasive material, a abrasive material constructed in the surface area layer of the substrate contains the abrasive layer of the abrasive particles and the binder (see, for example, Japanese Patent No. 6091704). In the existing abrasive material, the abrasive layer is constituted by a plurality of regions (abrasive portions) that are divided by the groove, and control the maximum projections height of the surface of the abrasive portion, thereby making the processing efficiency and processing. The flatness coexisted at a high level. [0003] The existing abrasive material is a fixed abrasive grain mode, and the abrasive layer is slowly worn by grinding, and the life is terminated due to abrasive laye...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00B24D3/28
CPCB24D3/28B24D3/002B24B37/26B24D11/04
Inventor 中根聡一郎岩永友树
Owner BANDO CHEM IND LTD