Wafer cleaning apparatus and wafer cleaning method

Abstract

The invention provides a wafer cleaning apparatus and a wafer cleaning method. The apparatus comprises a conveyor belt, wherein a first cleaning zone, an overturning zone and a second cleaning zone are successively disposed in the conveying direction of the conveyor belt; in the first cleaning zone, a first nozzle for spraying a cleaning liquid onto the first surface of a wafer on the conveyor belt is disposed above the conveyor belt; in the second cleaning zone, a second nozzle for spraying a cleanser onto the second surface, opposite to the first surface, of the wafer is disposed above the conveyor belt; and in the overturning zone, an overturning mechanism for overturning the wafer is disposed. The wafer cleaning apparatus sprays the cleaning liquid onto the surfaces of the wafer by the nozzles instead of a traditional mechanical cleaning method, reduces the scratches on the surfaces of the wafer, improves the surface quality of a product, changes a traditional batch cleaning modeto a single wafer cleaning mode, shortens the standby time of the cleaning project, shortens the cycle, improves productivity, and improves cleaning force, quality and productivity by double-sided cleaning.

Description

technical field [0001] The invention relates to the field of semiconductor material manufacturing, in particular to a wafer cleaning device and a wafer cleaning method. Background technique [0002] As a material for manufacturing semiconductor elements, silicon wafers (Si wafers) are widely used. A silicon wafer is a wafer in which the same type of silicon is grown on the silicon surface. Silicon wafers are widely used because they are excellent in the purity and crystallization properties of regions where semiconductors are integrated, and are beneficial to the yield and device characteristics of semiconductor devices. [0003] Usually, the surface of the lapped wafer is polluted by lapping oil and powder sludge. When the next project is carried out in this state, in addition to the scratches on the surface of the wafer, the metal components in the lapping powder (Lapping powder) may contaminate the equipment of the next project. Pollutants on the round surface should b...

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Problems solved by technology

[0005] In this case, the effect of the surfactant decreases with the passage of time, and the direct mechanical friction between the brush mainly composed of nylon and the surface of the wafer will cause scratches on the surface of the wafer, etc. The quality of the round surface deteriorates; on the other hand, there is also the problem of managing the life time (Life time) of the brush during use; in addition, the abrasive dust removed by the upper brush (Upper Brushing) will flow to the lower brush on the lower side (Lower brush), and this has become another reason that may cause scratches on the wafer surface

[0006] It can be seen that through the existing mechanical cleaning method, it is not only difficult to remove the effective pollutants on the edge (Edge) of the wafer, but also there are problems in the management of the cleaning solution of the tank (Bath) containing surfactant. how difficult

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