Testing structure and method for back drill alignment degree of 5G circuit board

Abstract

The utility model discloses a testing structure for the back drill alignment degree of a 5G circuit board. The testing structure comprises first to nth layers of core plates which are sequentially laminated from top to bottom, wherein n is a natural number, and n is greater than 2. The first to nth layers of core plates further comprise: first to wth testing units, outgoing lines and second testing columns. The first to wth testing units and the outgoing lines are all arranged on the mth core plate, the second testing columns penetrate through the mth core plate, the rth testing unit is connected with the (r + 1) th testing unit through the outgoing lines and the second testing columns are connected with the outgoing lines, wherein r, w and m are all natural numbers, and 0<r<w-1, and 1<m<n. According to the invention, a circuit is designed on the core board on a PCB, and the back drilling offset is detected by testing whether the current passes through a loop line, so, in this way, theback drilling offset of the PCB can be detected on a large scale, the speed is high, the detection amount is large, and the detection efficiency is improved. Meanwhile, an accurate offset range valuecan be provided, and a basis is provided for later adjustment.

Description

technical field [0001] The invention belongs to the technical field of PCB board manufacturing, and in particular relates to a test structure and method for back-drilling alignment of a 5G circuit board. Background technique [0002] In the production of PCB, the function of back drilling is to drill out the through-hole section that does not play any connection or transmission role, so as to avoid reflection, scattering, delay, etc. of high-speed signal transmission, which will bring "distortion" to the signal. During the back-drilling process, if the back-drill and the first-drill have offset holes, it is very easy to cause the copper in the first-drill part of the hole wall to be completely drilled, resulting in signal transmission distortion. [0003] At present, slices are usually used to check the alignment of the back drill, and the inspection workload is heavy, time-consuming and labor-intensive, and it is difficult to judge. This slice inspection method is ineffici...

AI Technical Summary

Problems solved by technology

During the back drilling process, if the back drill and the first drill have offset holes, it is very easy to cause the copper in the first drill part of the hole wall to be completely drilled, resulting in signal transmission distortion

[0003] At present, slices are usually used to check the alignment of the back drill, and the inspection workload is heavy, time-consuming, laborious, and difficult to judge.

This method of slice inspection is inefficient and time-consuming, and it is easy to miss inspections of boards with poor back-drilling accuracy, resulting in batch scrapping and even abnormal boards flowed to customers, resulting in immeasurable losses

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