Production process method of FPC multilayer board

Abstract

The invention relates to a production process method of an FPC (flexible printed circuit) multilayer board. The method comprises the steps of: manufacturing through hole data, and manufacturing four through holes at the corners of the FPC multilayer board; punching a location hole by adopting a target-shooting machine; regulating laser parameters, performing laser shooting on carbon powder printson the surface of the FPC multilayer board by using PAD shape deviation detection rings corresponding to the through holes; detecting the relative positions of the PAD shape deviation detection ringsand the through holes; performing micro-etching of the FPC multilayer board; ionizing the gas into a plasma state, and removing glue from the blind holes and the through holes; depositing copper on the surface of the FPC multilayer board and the inner walls of the holes; and drilling four through holes in the FPC multilayer board by using an exposure machine for positioning exposure, and performing outer layer pattern transfer. The production process method of the FPC multilayer board ensures that the blind holes, the through holes and the pattern layers are consistent, improves the relative offset of the blind holes and the through holes, and improves the manufacturing yield of the outer layer pattern; and moreover, the PAD shape deviation detection rings are added, the relative deviations of the blind holes and the through holes can be rapidly compared, defective products can be rapidly intercepted, and the excellent rate of products is improved.

Description

technical field [0001] The invention relates to the technical field of FPC multilayer board production, and more specifically refers to a production process method for FPC multilayer boards. Background technique [0002] In the 21st century, with the continuous development of electronic technology and the increasing functional requirements of consumers, as the base of electronic products, printed circuit boards will also be optimized and upgraded in terms of structure and technology. In order to achieve various and complex Functionality, double-sided boards and multi-layer boards combined with blind through holes are becoming more and more common. [0003] Due to the thinner thickness of FPC double-sided products, laser machine can be used to produce blind and through holes together. At the same time, the expansion and contraction temperature is easy to control during the production process. Even though through and blind holes are processed separately, the through and blind ...

AI Technical Summary

Problems solved by technology

However, for FPC multi-layer flexible boards, the thickness of the laminated boards is relatively thick, and blind through holes cannot be processed at the same time. It is necessary to separately use mechanically processed through holes and laser processed blind holes, and the products after stacking have large expansion and shrinkage, and there are different states of expansion and contraction. , leading to processing difficulties, prone to blindness, and serious relative deviation of through holes, which will affect the overall yield of the product. At the same time, if it is not identified in this process, it will seriously waste production resources and time in subsequent processes. Therefore, it cannot meet production demand

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