A kind of production technology method of fpc multi-layer board

Abstract

The invention relates to a production process method of an FPC multi-layer board, which includes: making through-hole materials, making four through-holes at the corners of the FPC multi-layer board; punching and drilling positioning holes with a target machine; Corresponding PAD shape analyzer ring, laser toner imprint on the FPC multilayer board surface; detect the relative position of the PAD shape analyzer ring and the through hole; micro-etch the FPC multilayer board; ionize the gas into a plasma state, Blind holes and through holes are removed from glue; copper is deposited on the surface of the FPC multilayer board and the inner wall of the hole; four through holes are drilled with an exposure machine for positioning and exposure, and the outer layer pattern is transferred. The invention makes the blind holes, the through holes and the pattern layers consistent, improves the relative offset of the blind holes and the through holes, and improves the production yield of the outer layer pattern; at the same time, the PAD shape analyzer ring is added, which can quickly compare The relative offset of blind holes and through holes can quickly intercept defective products and improve the good rate of products.

Description

technical field [0001] The invention relates to the technical field of FPC multilayer board production, and more specifically refers to a production process method for FPC multilayer boards. Background technique [0002] In the 21st century, with the continuous development of electronic technology and the increasing functional requirements of consumers, as the base of electronic products, printed circuit boards will also be optimized and upgraded in terms of structure and technology. In order to achieve various and complex Functionality, double-sided boards and multi-layer boards combined with blind through holes are becoming more and more common. [0003] Due to the thinner thickness of FPC double-sided products, laser machine can be used to produce blind and through holes together. At the same time, the expansion and contraction temperature is easy to control during the production process. Even though through and blind holes are processed separately, the through and blind ...

AI Technical Summary

Problems solved by technology

However, for FPC multi-layer flexible boards, the thickness of the laminated boards is relatively thick, and blind through holes cannot be processed at the same time. It is necessary to separately use mechanically processed through holes and laser processed blind holes, and the products after stacking have large expansion and shrinkage, and there are different states of expansion and contraction. , leading to processing difficulties, prone to blindness, and serious relative deviation of through holes, which will affect the overall yield of the product. At the same time, if it is not identified in this process, it will seriously waste production resources and time in subsequent processes. Therefore, it cannot meet production demand

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