Turret mounting machine

Abstract

The present invention discloses a turret mounting machine, which comprises a rack electronic control module. The top of the rack electronic control module is provided with a carrier pallet basket lifting device. One side of the carrier pallet basket lifting device is provided with a carrier pallet grasping and conveying device. One side of the carrier pallet grasping and conveying device is provided with a carrier pallet automatic transmission device. The carrier pallet automatic transmission device is connected with a sorting XYtheta compensation system and one side of a sorting XYtheta videosystem is provided with a turret high-speed pick-and-place system. One side of the turret high-speed pick-and-place system is provided with a wafer XYtheta compensation system; the top of the wafer XYtheta compensation system is provided with a wafer CCD video system; the wafer XYtheta compensation system is provided with a XY self-correcting thimble system; one side of the XY self-correcting thimble system is provided with a wafer grasping and conveying device; and one side of the wafer grasping and conveying device is provided with a wafer basket lifting device. The invention solves the problems that a traditional mounting machine adopts a structure of single swing arm and single suction nozzle, the operation accuracy and production speed can not be improved, and the high-speed high-precision surface mounted product manufacturing requirements can not be satisfied.

Description

technical field [0001] The invention belongs to the technical field of industrial automation, and in particular relates to a turret-type placement machine. Background technique [0002] Placement machine: also known as "mounting machine" and "Surface Mount System", in the production line, it is configured after the dispensing machine or screen printing machine, and the surface mount system is mounted by moving the mounting head. A device that accurately places components on PCB pads, divided into manual and fully automatic. [0003] Traditional placement machines and die-bonding machines adopt a single-swing arm and single-suction nozzle structure. Due to the limitations of the mechanical structure of the equipment, its operating accuracy and production speed cannot be improved, and its production efficiency is low and its quality is unstable. Bring difficulties and affect the packaging quality. It can only be applied to some products with low precision and speed requireme...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the existing defects and provide a turret-type chip mounter to solve the problem that the traditional chip mounter proposed in the above-mentioned background technology adopts a single swing arm and a single suction nozzle structure. Due to limitations, its running accuracy and production speed cannot be improved, its production efficiency is low, and it cannot meet the requirements of high-speed, high-precision, and high-reliability SMT product manufacturing.

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