A special conductive paste for glass-based circuit boards

Abstract

The invention provides a special conductive paste for glass-based circuit boards, which is characterized in that it consists of special conductive materials, organic binders and inorganic additives; based on 100 parts by mass of the special conductive paste for glass-based circuit boards, Among them, there are 78-87 parts of special conductive materials, 9-10 parts of organic binders, and 3-13 parts of inorganic additives; the inorganic additives are glass powder. The invention improves the mass ratio of the special conductive material in the conductive paste, enhances the electric conductivity of the circuit; selects an organic binder and an inorganic additive with excellent performance, and selects an appropriate proportion to make the viscosity of the paste moderate, It has good fluidity and strong adhesion, and makes the contact between the particles of special conductive materials closer. It is easy to form a continuous and dense silver film when printing circuit boards, and the resistivity is small; special conductive materials are selected, and the special conductive materials themselves have good compactness. Sex, and good flexibility.

Description

technical field [0001] The invention relates to a special conductive paste for a glass-based circuit board, which belongs to the technical field of electronic materials. Background technique [0002] Conductive paste is generally composed of conductive metal powder, binder, solvent and other auxiliary agents, and is printed on the paste carrier by a certain printing method, and solidified under a certain temperature and time to form a conductive circuit. The content of the metal conductive material in the paste will directly affect the electrical conductivity of the circuit. Studies have shown that when the content of the conductive material in the conductive paste is 80% to 90% by weight, the electrical conductivity is the best. At present, the proportion of conductive materials in the conductive paste for making glass-based circuit boards is less than 75%. It has sufficient cohesive force and will not cause the conductive particles to fall off, so it is difficult to incre...

AI Technical Summary

Problems solved by technology

At present, the proportion of conductive materials in the conductive paste for making glass-based circuit boards is less than 75%. It has sufficient adhesive force to prevent the conductive particles from falling off, so it is difficult to increase the content of conductive materials in the existing paste

However, the mass ratio of the traditional conductive paste has not reached the optimal ratio of the conductive material content in the paste, and there is still room for improvement in the conductivity, and the use of a large number of additives greatly increases the brittleness of the conductive line, and deformation occurs on the glass substrate. It is easy to break and cause damage to the glass-based circuit board