Camera module, electronic device and method for making camera module
A technology of a camera module and a manufacturing method, which is applied in the field of cameras and can solve the problems of large thickness of the camera module and the like
Active Publication Date: 2021-04-09
OPPO CHONGQING INTELLIGENT TECH CO LTD
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Problems solved by technology
[0004] In related technologies, in order to facilitate the installation of the camera module, it is necessary to arrange the optical filter and the photosensitive chip at intervals, and the optical filter itself has a certain thickness, so that the thickness of the installed camera module is relatively large.
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[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
[0039] The camera module 100 is a complex system integrating optics, mechanics, electricity, software and hardware. The camera module 100 mainly includes a lens assembly 70 , a filter structure, a photosensitive chip 30 and a circuit board 10 . The light emitted by the object to be photographed is presented on the photosensitive chip 30 through the lens assembly 70. The photosensitive chip 30 converts the received light signal into an electrical signal, and after a series of processing by the circuit board 10, it is finally converted into a red color that can be recognized on the screen. Green-blue (Red, Green, Blue, RGB) image.
[0040] Because any object will emit visible light and infrared light in an environment of absolute zero (-273°C). According to the principle and ...
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The invention discloses a camera module, an electronic device and a method for making the camera module, wherein the camera module includes: a circuit board, the circuit board has a mounting surface; a support seat, the support seat is arranged on the mounting surface , and a mounting hole connected to the mounting surface is provided; a photosensitive chip is arranged on the mounting surface and is located in the mounting hole, and the photosensitive chip is electrically connected to the circuit board; a support body, the The support body is filled in the installation hole and covers the photosensitive chip; the support body is made of a light-transmitting material, and the surface of the support body away from the circuit board is provided with a first infrared filter film; the lens assembly, The lens assembly is disposed on a side of the first infrared filter film away from the support body. The camera module of the technical solution of the present invention has clear images and a small thickness.
Description
technical field [0001] The invention relates to the technical field of cameras, in particular to a camera module, an electronic device and a method for manufacturing the camera module. Background technique [0002] Most of the electronic devices are equipped with a camera module, through which the optical signal is converted into an electrical signal, so that the electronic device has the function of taking pictures and video. [0003] The photosensitive chip in the camera module can recognize the visible light and infrared light emitted by the object, and the infrared light usually affects the imaging of the object, making the captured image appear variegated, and it is difficult to restore the real image of the object. The light sheet filters the infrared light emitted by the object. [0004] In the related art, in order to facilitate the installation of the camera module, the optical filter and the photosensitive chip need to be arranged at intervals, and the optical fil...
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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/50H04N23/57H04N23/55
Inventor 姜洋
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD