Continuous casting manufacturing method of polishing pad

Abstract

The invention discloses a continuous pouring and manufacturing method of a polishing pad, and relates to the field of semiconductor preparation. According to the technical scheme, the method comprises the steps of conveying a mold containing an annular mold frame of any size to a pouring region of a pouring machine through a conveyor belt, a pouring head of the pouring machine is moved to the portion above the circle center of the mold frame, materials begin to be poured into the mold frame, a pouring body is obtained after pouring is finished, the mold is conveyed to the next working procedure through the conveyor belt, a next mold is conveyed to the pouring region through the conveyor belt, and the processes are repeatedly performed for pouring; due to the circle center positioning process and the pouring process and the pouring head improvement, the automatic degree is increased, the production efficiency is effectively improved, the accurate positioning and stability of pouring are improved, the quality of the polishing pad is improved, and the rejection rate is effectively lowered.

Description

technical field [0001] The invention relates to the field of semiconductor preparation, in particular to a production method of a polishing pad used for planarizing the unevenness on the surface of a polished body such as a semiconductor wafer with chemical mechanical polishing (CMP). Background technique [0002] In the manufacture of semiconductor devices, the process of forming a conductive film on the surface of a semiconductor wafer (hereinafter also referred to as a wafer) and forming a wiring layer by performing photolithography, etching, etc.; forming an interlayer insulating film on the wiring layer Processes, etc., on the surface of the wafer, irregularities made of conductors such as metals or insulators are generated on the wafer surface due to these processes. In recent years, miniaturization of wiring and multilayer wiring have been carried out for the purpose of increasing the density of semiconductor integrated circuits. Along with this, the technology of fla...

AI Technical Summary

Problems solved by technology

Due to the high accuracy of the positioning of the center of the circle, and the size of the cake may be deviated or changed, this method requires frequent manual calibration of the position of the pouring head, the deviation of the position calibration is relatively large, and the operation is not convenient enough

In addition, this method has high requirements on the conveyor belt. During the moving process of the conveyor belt, the position of the mold must be accurately aligned without deviation. It also places strict requirements on equipment and operators, which not only reduces production efficiency, but also affects the quality of the product. Quality takes a toll

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