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PCB ink printing process method

A process method and ink printing technology, which is applied in the secondary processing of printed circuits, coating non-metallic protective layers, etc. Issues such as electrical performance of electrical function modules, to achieve the effect of thorough exposure, improved accuracy, and guaranteed electrical performance

Inactive Publication Date: 2019-10-11
惠州美锐电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In many fields, components need to be mounted or plugged with high precision. The existing PCB production process can easily cause the thickness of the ink to be too thick. The precision of plugging cannot meet the requirements of high-precision placement or function
Moreover, with the multi-functionalization and integration of electronic components, there are more and more PIN pins of components, the distance between adjacent PIN pins is getting smaller and smaller, and the pad spacing on the corresponding PCB is also getting smaller and smaller. , when the current PCB production process reduces the spacing between the pads, the ink layer (ie, the oil bridge) between the pads is easy to fall off, which affects the electrical performance of the electrical functional module produced

Method used

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Embodiment 1

[0026] A kind of PCB ink printing process method, used as the making of PCB board, comprises the following steps:

[0027] Step 1: Pre-treatment, through pre-treatment to enhance the adhesion of the ink on the PCB board, to ensure the adhesion of the ink, mainly for roughening treatment to enhance the adhesion of the ink on the PCB board, mechanical roughening or chemical roughening can be used Methods. For example, volcanic ash grinding or super-roughening treatment can be used. After roughening treatment, the degree of roughening can be checked by testing the wear marks. Generally, the wear marks are required to be between 10mm and 15mm. After mechanical roughening treatment, it needs to be cleaned. After cleaning, the effect of cleaning is tested by water film. Generally, the water film test requires more than 30S.

[0028] Step 2: Silk screen the first layer of ink, and use the process of screen printing to print a layer of ink on the entire area of ​​the PCB board. The s...

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Abstract

The invention discloses a PCB ink printing process method. The PCB ink printing process method comprises the steps of: (1), performing pre-treatment, wherein the adhesive force of ink on a PCB is enhanced through pre-treatment; (2), performing silk printing of the first layer of ink, wherein silk printing of a layer of ink on the area of the PCB, except a functional area, is carried out through asilk-screen printing process method; (3), performing pre-drying, wherein the ink is dried till the ink is non-viscous; (4), performing silk printing of the second layer of ink, wherein silk printing of a layer of ink on the area of the PCB, except the functional area, is carried out again through the silk-screen printing process method; (5), performing pre-drying, wherein the ink is dried till theink is non-viscous; and (6), performing after-treatment, wherein an ink curing layer is formed in the specific area on the PCB through after-treatment. The PCB ink printing process method in the invention is used for PCB production and manufacturing.

Description

technical field [0001] The invention relates to the technical field of PCB board production technology, in particular to a PCB ink printing process method. Background technique [0002] PCB (Printed Circuit Board, circuit board) is a commonly used component in electrical equipment. Usually, various components need to be mounted or inserted on the PCB to form electrical functional modules to realize various functions of electrical equipment. In many fields, components need to be mounted or plugged with high precision. The existing PCB production process can easily cause the thickness of the ink to be too thick. The precision of plugging cannot meet the requirements of high-precision placement or function. Moreover, with the multi-functionalization and integration of electronic components, there are more and more PIN pins of components, the distance between adjacent PIN pins is getting smaller and smaller, and the pad spacing on the corresponding PCB is also getting smaller a...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/28
Inventor 陈超兵何泳龙杨帅
Owner 惠州美锐电子科技有限公司
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