Production process of ultrasonic atomization piece

Abstract

The invention belongs to the technical field of atomization pieces, and particularly relates to a production process of an ultrasonic atomization piece. The production process of the ultrasonic atomization piece, disclosed by the invention, comprises the following steps of S1, cutting a pressure thermosetting conductive film to annular shapes having same size with annular piezoelectric ceramic foruse; S2, placing the pressure thermosetting conductive film on a flexible printed circuit (FPC), and then placing the annular piezoelectric ceramic on the pressure thermosetting conductive film, wherein the FPC comprises a round PI thin film and an annular copper foil; S3, placing a red silica gel pad at each of an upper side and a lower side of a product obtained in the step S2, placing the product in a pressure machine, simultaneously heating to 80-150 DEG C by the pressure machine at pressure being 6-15MPa to laminate the product, and continuing for 100-300 seconds; S4, uniformly punchinga plurality of microscale small holes in the central PI thin film of the FPC of the laminated product by a laser machine; and S5, performing energization detection on the product obtained in the S4 toobtain a qualified product.

Description

technical field [0001] The invention belongs to the technical field of atomizing sheets, and in particular relates to a production process of ultrasonic atomizing sheets. Background technique [0002] The ultrasonic atomizing sheet breaks up the molecular structure of liquid water through the high-frequency resonance of the ceramic atomizing sheet to generate a natural and elegant water mist without heating or adding any chemical reagents; compared with the heating atomization method, energy is saved by 90 %; In addition, a large amount of negative ions will be released during the atomization process, which will produce electrostatic reactions with the smoke and dust floating in the air to make them precipitate, and at the same time, it can also effectively remove formaldehyde, carbon monoxide, bacteria and other harmful substances, so that the air can be clean Purify and reduce the occurrence of diseases. The main structure of the traditional mesh-type ultrasonic atomizing...

AI Technical Summary

Problems solved by technology

[0005] In further tests, it was found that when the PI film at the center of the FPC flexible circuit board is in a non-tight state, the high-frequency vibration generated by the annular piezoelectric ceramic will be absorbed by the PI film, and the amplitude generated is not enough for the PI film to produce regular vibrations. Oscillation; the test also found that even if the PI film is in a tight state, the efficiency will drop due to the wrinkles formed by the surrounding copper foil. During the process, a scattered waveform transmission is formed at the folds, thereby reducing the oscillation amplitude of the film. The specific waveform transmission schematic diagram is as follows Figure 4 shown;

[0006] To sum up, the copper foil of the product obtained by bonding the FPC flexible circuit board with solder paste or glue, etc., and the ultrasonic atomized sheet made of annular piezoelectric ceramics is easy to form wrinkles, and the PI film is not easy to be in a tight state ; And the stability of product production is poor

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