Film and its preparation method, copper clad laminate
A film and thermal conductivity technology, which is applied in the field of communication to achieve the effect of improving thermal conductivity and stabilizing dielectric constant
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[0038] The present invention also provides a kind of preparation method of above-mentioned film, comprises the following steps:
[0039] S1, providing a first filler and a second filler, the thermal conductivity of the first filler is greater than or equal to 30W / m·k, the thermal conductivity of the second filler is smaller than the thermal conductivity of the first filler, and the second The dielectric constant of the filler is smaller than that of the first filler, and a fluorine-containing coupling agent is grafted on the first filler and the second filler to obtain a modified first filler and a modified second filler;
[0040] S2, mixing the modified first filler, the modified second filler and a fluorine-containing resin to obtain a resin composition, then mixing the resin composition with a flocculant to obtain a mixed solution, and mixing the The liquid is dried and pulverized to obtain resin particles;
[0041] S3, mixing the resin particles and auxiliary agents to o...
Embodiment 1
[0063] Add 10 parts of aluminum oxide (D 50 10 μm) to form an alumina dispersion, then slowly drop 0.1 part of perfluorodecyltrimethoxysilane, stir at high speed for 1 h to form a uniform dispersion, and dry in an oven to obtain modified alumina. Similarly, add 10 parts of silicon dioxide (D 50 10 μm) to form a silica dispersion, then slowly drop 0.1 part of perfluorodecyltrimethoxysilane, stir at high speed for 1 h to form a uniform dispersion, and dry in an oven to obtain modified silica.
[0064] The modified alumina, modified silicon dioxide and 50 parts of PTFE emulsion (58% solid content) were evenly mixed to form a resin composition, and then 10 parts of PEI flocculant was added and stirred for 0.5 h to obtain a mixed solution. The mixed liquid was dried at 105° C. for 12 hours and then pulverized to obtain resin particles with a particle diameter of 1.5 mm, and the water content of the resin particles was ≤0.1%.
[0065] Mix the resin particles and 20 parts of kerose...
Embodiment 2
[0068] Add 15 parts of aluminum oxide (D 50 5 μm) to form an alumina dispersion, then slowly dropwise add 0.15 parts of perfluorodecyltrimethoxysilane, stir at high speed for 1 h to form a uniform dispersion, and dry in an oven to obtain modified alumina. Similarly, add 10 parts of silicon dioxide (D 50 15 μm) to form a silica dispersion, then slowly drop 0.2 parts of perfluorodecyltrimethoxysilane, stir at high speed for 1 h to form a uniform dispersion, and dry in an oven to obtain modified silica.
[0069] The modified alumina, modified silicon dioxide and 50 parts of PTFE emulsion (58% solid content) were evenly mixed to form a resin composition, and then 10 parts of PEI flocculant was added and stirred for 0.5 h to obtain a mixed solution. The mixed solution was dried at 105° C. for 12 hours and then pulverized to obtain resin particles with a particle diameter of 1.3 mm, and the water content of the resin particles was ≤0.1%.
[0070] Mix the resin particles and 15 par...
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