Manufacturing process of two-dimensional material filled copper-clad plate

A two-dimensional material and manufacturing process technology, which is applied in the fields of printed circuit manufacturing, printed circuit precursor manufacturing, printed circuit secondary processing, etc., can solve problems such as high dielectric loss and inability to meet high-frequency circuit performance requirements, and achieve dielectric The effect of stable electrical properties, low dielectric loss, and low dielectric constant

Inactive Publication Date: 2020-09-08
SUNWAY COMM JIANGSU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the important component material in the printed circuit board is copper clad laminate. The existing copper clad laminate is mainly made of FR4 (epoxy resin substrate), hydrocarbon and other substrates. The traditional copper clad laminate has high dielectric loss and cannot Meet the performance requirements of high-frequency circuits in the 5G era

Method used

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  • Manufacturing process of two-dimensional material filled copper-clad plate
  • Manufacturing process of two-dimensional material filled copper-clad plate
  • Manufacturing process of two-dimensional material filled copper-clad plate

Examples

Experimental program
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Effect test

Embodiment 1

[0044] Please refer to figure 1 and figure 2 , Embodiment 1 of the present invention is: a manufacturing process for filling copper clad laminates with two-dimensional materials, including the following steps: S1, mixing two-dimensional materials with modifiers to obtain modified mixed solutions, which are filtered, cleaned and Dry to obtain the modified two-dimensional filler; S2, mix the matrix material with the dispersant to obtain a dispersed emulsion, the matrix material is PTFE or polyphenylene ether resin; S3, add the modified filler to the dispersed emulsion, fully After mixing evenly, transfer it to the dipping tank. In this embodiment, the dispersed emulsion is mixed with the modified two-dimensional filler to obtain a dispersion liquid, and the glass fiber cloth is impregnated with the dispersion liquid, and heat-treated to obtain a prepreg; S4. combined to prepare a two-dimensional material filled copper clad laminate. In other feasible embodiments, the matrix m...

Embodiment 2

[0053] Please refer to figure 1 and image 3 , Embodiment 2 of the present invention is: a manufacturing process of a two-dimensional material filled copper clad laminate, comprising the following steps:

[0054] S1. The two-dimensional material is organic montmorillonite (OMMT), and the modifier is cetyltrimethylammonium chloride. The ratio is mixed, then add acetic acid to it to adjust it to acidity, stir at a speed of 600-800rpm and accompany with ultrasonic water bath for 8-12h; in the above dispersion, add cetyltrimethylammonium chloride, continue Ultrasound for 2-4 hours; then transfer the modified solution to a flask, raise the temperature to 50-80°C, stir mechanically for 10-12 hours, cool down to room temperature, and finally centrifugally purify the modified solution, filter it with a microporous membrane, and repeatedly use distilled water Rinse and dry to obtain modified OMMT;

[0055] S2. Mix the matrix material with a dispersant to obtain a dispersed emulsion....

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Abstract

The invention discloses a manufacturing process of a two-dimensional material filled copper-clad plate, which comprises the following steps: S1, modifying a two-dimensional material by using a modifier to obtain a modified two-dimensional filler; S2, mixing a base material and a dispersing agent, obtaining dispersion emulsion, wherein the base material is PTFE or polyphenyl ether resin; S3, addingthe modified two-dimensional filler into the dispersion emulsion, fully and uniformly mixing, transferring into an impregnation tank, impregnating the dispersion liquid with glass fiber cloth, and carrying out heat treatment to obtain prepregs; and S4, pressing the prepreg and copper to obtain the two-dimensional material filled copper-clad plate. The modified two-dimensional material is used asa dispersion phase to be added into a matrix material, so that the prepared copper-clad plate has a relatively low dielectric constant, relatively low dielectric loss and relatively high thermal conductivity, is stable in dielectric property, and can meet the performance requirements of a high-frequency circuit in the 5G era.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a manufacturing process of two-dimensional material filled copper clad laminates. Background technique [0002] Printed circuit boards are made of insulating substrates and conductors, and are made into finished boards containing printed circuits, printed components, etc. according to pre-designed circuit diagrams, and are widely used in various electronic devices. Among them, the important component material in the printed circuit board is copper clad laminate. The existing copper clad laminate is mainly made of FR4 (epoxy resin substrate), hydrocarbon and other substrates. The traditional copper clad laminate has high dielectric loss and cannot Meet the performance requirements of high-frequency circuits in the 5G era. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a manufacturing process of a low di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/22H05K3/00
CPCH05K3/0094H05K3/022H05K3/227
Inventor 刘飞华刘仕明宋喆虞成城
Owner SUNWAY COMM JIANGSU CO LTD
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