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Olefin-benzoxazine copolymer oligomer, cross-linked resin and preparation method thereof

A technology of benzoxazine and cross-linking resin, which is applied in the directions of printed circuit parts, printed circuits, circuit substrate materials, etc., can solve the problems such as the inability to adjust the proportion of components in a large range, and the compatibility of resins is easy to appear.

Active Publication Date: 2020-08-11
SHANDONG UNIV
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Although the preparation method is simple, it is prone to compatibility problems between resins, and the ratio of each component cannot be adjusted in a wide range

Method used

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  • Olefin-benzoxazine copolymer oligomer, cross-linked resin and preparation method thereof
  • Olefin-benzoxazine copolymer oligomer, cross-linked resin and preparation method thereof
  • Olefin-benzoxazine copolymer oligomer, cross-linked resin and preparation method thereof

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Embodiment Construction

[0014] To achieve the above object, the present invention is achieved through the following technical solutions:

[0015] The olefin-benzoxazine co-oligomer is characterized in that it has the general formula of the following formula I or formula II:

[0016]

[0017]

[0018] Where X=1-100, Y=1-200, Z=0-200

[0019] R 1 =-H,-CH 3 ,-C(CH 3 ) 3 ,-C 15 h 31 -n

[0020] R 2 =-H,-CH3

[0021]

[0022] The present invention also provides a preparation method of the above-mentioned olefin-benzoxazine co-oligomer.

[0023] The preparation method of olefin-benzoxazine co-oligomer comprises steps as follows:

[0024] Aldehyde compounds, phenolic compounds and amine compounds are dissolved in an organic solvent and reacted at 80-120°C for 4-10h, and the obtained benzoxazine monomer and olefin monomer are used at 70-120°C The copolymerization is initiated by a base initiator to obtain an olefin-benzoxazine co-oligomer.

[0025] Preferably according to the present inv...

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Abstract

The invention relates to an olefin-benzoxazine copolymer oligomer, cross-linked resin and a preparation method of the olefin-benzoxazine copolymer oligomer and the cross-linked resin. A free radical initiator is selected, a benzoxazine monomer containing double bonds and a diene monomer are adopted for free radical binary copolymerization, or a third monomer styrene is added for free radical ternary copolymerization, olefin-benzoxazine copolymerization oligomers are synthesized, and the copolymerization oligomers are soluble by controlling the reaction degree. Then, further heating is carriedout to enable the benzoxazine ring to be subjected to a ring-opening reaction; consequently, cured resin is produced, according to the invention, the low dielectric property of hydrocarbon resin and the excellent performance of polybenzoxazine are combined together at the molecular level; the problem of compatibility between resins is solved, and the composition proportion of polydiene and polyoxazine in a molecular chain can be regulated and controlled in a large range, so that a novel high polymer material with low dielectric constant, low dielectric loss, high heat resistance and high adhesive property is obtained.

Description

technical field [0001] The invention relates to an olefin-benzoxazine co-oligomer, a crosslinked resin and a preparation method thereof, and belongs to the technical field of polymer materials. Background technique [0002] The advent of the 5G era requires that the electronic materials and devices used have the functions of high-frequency, high-speed and large-capacity storage and signal transmission. Therefore, the development of high-frequency copper-clad laminates has become the focus of increasing attention. In high-frequency copper clad laminates, the signal transmission rate is inversely proportional to the square of the dielectric constant, and the signal loss is proportional to the square of the dielectric loss. In order to meet the requirements of 5G communication, polymer materials with low dielectric constant (<2.5) and low dielectric loss (<0.005) must be used as the matrix resin of copper clad laminates to reduce the reduction of transmission rate and si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F236/08C08F226/06C08F236/06C08F212/08H05K1/03
CPCC08F212/08C08F226/06C08F236/06C08F236/08H05K1/0346
Inventor 鲁在君徐利春李家作夏永全衣同刚
Owner SHANDONG UNIV
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