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Room-temperature-curable epoxy pouring sealant used under temperature shock environment condition and production method of room-temperature-curable epoxy pouring sealant used under temperature shock environment condition

A technology that cures under ambient conditions and at room temperature. It is applied in the field of potting adhesives, which can solve problems such as easy cracking and debonding, and achieve good process performance.

Active Publication Date: 2019-11-12
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the potting glue in the prior art is easy to crack and debond when it is used in the warm shock environment, the present invention proposes a room temperature curing epoxy potting glue used in the warm shock environment and its preparation method

Method used

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  • Room-temperature-curable epoxy pouring sealant used under temperature shock environment condition and production method of room-temperature-curable epoxy pouring sealant used under temperature shock environment condition
  • Room-temperature-curable epoxy pouring sealant used under temperature shock environment condition and production method of room-temperature-curable epoxy pouring sealant used under temperature shock environment condition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] An epoxy potting adhesive that cures at room temperature and is used under warm and shock environment conditions, including: 33g epoxy resin E44, 15g 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate TDE-85, 12g tetrahydrofuran polyether epoxy (fnhy), 6.2g dibasic polyetheramine EDR104, 4.1g dibasic polyetheramine D230 and 0.6g benzyldiamine (BDMA).

[0042] This example also provides a preparation method for the above-mentioned epoxy potting glue that is cured at room temperature and used under warm-shock environment conditions. Potting compound.

Embodiment 2

[0044] An epoxy potting adhesive that cures at room temperature and is used under warm and shock environment conditions, including: 33g epoxy resin E51, 15g 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate TDE-85, 12g tetrahydrofuran polyether epoxy (fnhy), 8.0g dibasic polyetheramine EDR148, 5.3g dibasic polyetheramine D230 and 1.3g benzyldiamine (BDMA).

[0045] This example also provides a preparation method for the above-mentioned epoxy potting glue that is cured at room temperature and used under warm-shock environment conditions. Potting compound.

Embodiment 3

[0047] An epoxy potting adhesive that cures at room temperature and is used under warm and shock environment conditions, including: 33g epoxy resin E51, 15g 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate TDE-85, 12g polypropylene glycol diglycidyl ether (bechy), 9.8g dibasic polyetheramine EDR176, 6.5g dibasic polyetheramine D230 and 0.8g 2,4,5-tris(dimethylaminomethyl)phenol ( DMP-30).

[0048] This example also provides a preparation method for the above-mentioned epoxy potting glue that is cured at room temperature and used under warm-shock environment conditions. Potting compound.

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Abstract

The invention discloses a room-temperature-curable epoxy pouring sealant used under a temperature shock environment condition and a production method of the room-temperature-curable epoxy pouring sealant used under the temperature shock environment condition, and relates to the technical field of pouring sealants used under temperature shock environment conditions. The room-temperature-curable epoxy pouring sealant used under the temperature shock environment condition contains the following components in parts by mass: 100 parts of composite epoxy resin and 10-30 parts of a composite curing agent; the composite epoxy resin is composed of three epoxies of liquid bisphenol A epoxy resin, liquid epoxy resin of glycidyl ester and a polyether epoxy; and the composite curing agent is composed of liquid composite polyether amine and a curing accelerator. By compounding the epoxy with high activity, good adhesive performance and low temperature resistance, the highly-toughened epoxy and the bisphenol A epoxy into a composite epoxy, using the polyether amine with low temperature resistance and high tenacity as a main curing agent at the same time, and adjusting the curing speed of the sealant through the curing accelerator at the same time, balance of the activity, the tenacity, the adhesive performance and the technology performance of the sealant is achieved, the pouring sealant doesnot crack under the environment condition, debonding of metal is avoided, and the pouring sealant has good technology performance at the same time.

Description

technical field [0001] The invention relates to the technical field of potting glue used under warm shock environment conditions, and more specifically relates to a room temperature curing epoxy potting glue used under warm shock environment conditions and a preparation method thereof. Background technique [0002] General-purpose potting adhesives include epoxy, polyurethane and silicone potting adhesives, etc. Among them, epoxy potting adhesives have better comprehensive performance, so epoxy potting adhesives are selected under warm-shock conditions, and there are no reports in the literature. Epoxy potting adhesives that are subject to temperature shocks, such as Zhuang Mian's article "Preparation of Room Temperature Curing Epoxy Potting Adhesive", and Liao Hong's article "Development of Low Viscosity Room Temperature Curing Epoxy Potting Adhesive" have not mentioned And the researched epoxy potting glue is used under the condition of warm shock environment, Gao Shengman...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/50C08G59/68
CPCC08G59/504C08G59/686C08L2205/025C08L2205/03C09J163/00C08L63/00
Inventor 陈茂斌吴冶平赵秀丽张帮友陈忠涛陈茂廖宏张银宇
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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