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Low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof

A technology of conductive silver paste and high conductivity, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problem of high filling rate of commercial conductive silver paste and silver powder, and achieve excellent conductive network, Good electrical conductivity and excellent adhesion

Active Publication Date: 2019-11-12
深圳市博耀科技集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the silver powder filling rate of commercial conductive silver paste is too high, the object of the present invention is to provide a low-cost, high-conductivity, low-silver-content low-temperature curing conductive silver paste and its preparation method

Method used

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  • Low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof
  • Low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof
  • Low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof

Examples

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Effect test

Embodiment 1

[0032] A low-temperature curing conductive silver paste with high conductivity and low silver content comprises the following components: self-made nano-flaky silver powder containing 25 wt% in the conductive silver paste (the silver powder is wet silver powder, and the silver powder contains 48 wt% of solids, and the dispersant is DBE), 9.6 wt% 71 resin, 62.9wt% DBE, PM solvent and 2.5 wt% malonic acid solution (20% mass fraction, PM solvent), the average particle size of silver powder is 4.6 μm, and the thickness is 50-60nm.

[0033] Preparation method: S1. Preparation of organic carrier: Dissolve 71 resin with a mass fraction of 30% in 70% PM, heat at a constant temperature at 70°C until completely dissolved, and cool for use;

[0034] S2. first add DBE solvent in container;

[0035] S3. Then add 2.5 wt% malonic acid (mass fraction is 20%, solvent is PM);

[0036] S4. After stirring for 1-3 min, add 25 wt% self-made nano-flaky silver powder, and fully stir for 15-30 min t...

Embodiment 2

[0041] A low-temperature curing conductive silver paste with high conductivity and low silver content, comprising the following components:

[0042] The conductive silver paste contains 22 wt% self-made flaky silver powder (the silver powder is wet silver powder, the silver powder contains 50 wt% solid silver powder, and the dispersant is DBE), 9.6 wt% of 71 resin, 66.2 wt% of DBE solvent and 2.2 wt% of Malonic acid solution (mass fraction is 20%, solvent is DBE), the average particle size of silver powder is 4.6 μm, and the thickness is 50-60 nm.

[0043] Preparation method: S1. Preparation of organic carrier: Dissolve 71 resin with a mass fraction of 25% in 75% DBE, heat at a constant temperature at 60°C until completely dissolved, and cool for later use;

[0044] S2. first add DBE solvent in container;

[0045] S3. Then add 2.2 wt% malonic acid (mass fraction is 20%, solvent is DBE);

[0046] S4. After stirring for 1-3 min, add 22 wt% self-made nano-flaky silver powder, a...

Embodiment 3

[0051] A low-temperature curing conductive silver paste with high conductivity and low silver content, comprising the following components:

[0052] The conductive silver paste contains 20 wt% self-made flake silver powder (the silver powder is wet silver powder, the silver powder contains 55 wt% solid silver powder, and the dispersant is DBE), 9.6 wt% of 71 resin, 68.4 wt% of cyclohexanone, PM and DBE Solvent and 2 wt% adipic acid solution (mass fraction is 20%, solvent is PM), the average particle size of silver powder is 4.6 μm, and the thickness is 50-60 nm.

[0053] Preparation method: S1. Preparation of organic carrier: dissolve 71 resin with a mass fraction of 30% in 70% PM, heat at a constant temperature at 60°C until completely dissolved, and cool for use;

[0054] S2. first add cyclohexanone in container;

[0055] S3. add the adipic acid of 2 wt% subsequently (mass fraction is 20%, solvent is PM);

[0056] S4. After stirring for 1-3 min, add 20 wt% self-made nano-f...

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Abstract

The invention discloses low-temperature curing conductive silver paste with high conductivity and low silver content and a preparation method thereof. The conductive silver paste is composed of 5-30 wt% of homemade nano sheet-shaped silver powder, 9.6 wt% of polymer resin, 0.5-3 wt% of a conductive accelerant and 57.4-84.9 wt% of a solvent. The preparation method comprises the following steps: 1)preparing an organic carrier; 2) selecting according to the weight percentage of the formula; 3) weighing the solvent and the conductive accelerant according to the formula, and uniformly mixing; 4) adding the homemade nano sheet-shaped silver powder according to the formula, and uniformly dispersing; and 5) adding polymer resin according to the formula, and stirring until uniform conductive silver paste is formed. The conductive silver paste is excellent in conductivity after being cured into a film, the adhesive force reaches the zero level, and the silver content in the paste is greatly lower than that of commercial conductive silver paste (50-90 wt%). Therefore, the production cost is greatly reduced, and the conductive silver paste and the preparation method has a wide market application prospect.

Description

technical field [0001] The invention belongs to the technical field of conductive material composites, and in particular relates to a conductive silver paste and a preparation method thereof. Background technique [0002] In recent years, conductive silver paste has been widely used in the printed electronics industry, such as integrated circuits, solar cells, radio frequency identification tags, thin film transistors, biosensors, etc. Conductive silver paste refers to a kind of electronic paste printed on PET, ceramics, glass, cardboard and other insulators to enable current transmission and static charge removal capabilities. It is a key raw material for various electronic components and electrodes and other electronic products. [0003] According to the curing temperature, conductive silver paste can be divided into high-temperature sintered silver paste, medium-temperature sintered silver paste and low-temperature cured silver paste. Among them, low-temperature curing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 申玉求陈振兴王丹周勇刘意林思远
Owner 深圳市博耀科技集团有限公司
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