Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof

A technology of conductive silver paste and silver content, which is used in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problem of high filling rate of silver powder in commercial conductive silver paste, and achieve clear screen printing circuit diagrams , no flash, good conductivity

Active Publication Date: 2022-03-25
深圳市博耀科技集团有限公司
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the silver powder filling rate of commercial conductive silver paste is too high, the object of the present invention is to provide a low-cost, high-conductivity, low-silver-content low-temperature curing conductive silver paste and its preparation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof
  • A low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof
  • A low-temperature curing conductive silver paste with high conductivity and low silver content and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A low-temperature curing conductive silver paste with high conductivity and low silver content comprises the following components: self-made nano-flaky silver powder containing 25 wt% in the conductive silver paste (the silver powder is wet silver powder, and the silver powder contains 48 wt% of solids, and the dispersant is DBE), 9.6 wt% 71 resin, 62.9 wt% DBE, PM solvent and 2.5 wt% malonic acid solution (the mass fraction is 20%, the solvent is PM), the average particle size of the silver powder is 4.6 μm, and the thickness is 50-60nm.

[0033] Preparation method: S1. Preparation of organic carrier: Dissolve 71 resin with a mass fraction of 30% in 70% PM, heat at a constant temperature at 70°C until completely dissolved, and cool for use;

[0034] S2. first add DBE solvent in container;

[0035] S3. Then add 2.5 wt% malonic acid (mass fraction is 20%, solvent is PM);

[0036] S4. After stirring for 1-3 min, add 25 wt% self-made nano-flaky silver powder, and fully s...

Embodiment 2

[0041] A low-temperature curing conductive silver paste with high conductivity and low silver content, comprising the following components:

[0042] The conductive silver paste contains 22 wt% self-made flaky silver powder (the silver powder is wet silver powder, the silver powder contains 50 wt% solid silver powder, and the dispersant is DBE), 9.6 wt% of 71 resin, 66.2 wt% of DBE solvent and 2.2 wt% of Malonic acid solution (mass fraction is 20%, solvent is DBE), the average particle size of silver powder is 4.6 μm, and the thickness is 50-60 nm.

[0043] Preparation method: S1. Preparation of organic carrier: Dissolve 71 resin with a mass fraction of 25% in 75% DBE, heat at a constant temperature at 60°C until completely dissolved, and cool for later use;

[0044] S2. first add DBE solvent in container;

[0045] S3. Then add 2.2 wt% malonic acid (mass fraction is 20%, solvent is DBE);

[0046] S4. After stirring for 1-3 min, add 22 wt% self-made nano-flaky silver powder, a...

Embodiment 3

[0051] A low-temperature curing conductive silver paste with high conductivity and low silver content, comprising the following components:

[0052] The conductive silver paste contains 20 wt% self-made flake silver powder (the silver powder is wet silver powder, the silver powder contains 55 wt% solid silver powder, and the dispersant is DBE), 9.6 wt% of 71 resin, 68.4 wt% of cyclohexanone, PM and DBE Solvent and 2 wt% adipic acid solution (mass fraction is 20%, solvent is PM), the average particle size of silver powder is 4.6 μm, and the thickness is 50-60 nm.

[0053] Preparation method: S1. Preparation of organic carrier: dissolve 71 resin with a mass fraction of 30% in 70% PM, heat at a constant temperature at 60°C until completely dissolved, and cool for use;

[0054] S2. first add cyclohexanone in container;

[0055] S3. add the adipic acid of 2 wt% subsequently (mass fraction is 20%, solvent is PM);

[0056] S4. After stirring for 1-3 min, add 20 wt% self-made nano-f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a low-temperature curing conductive silver paste with high conductivity and low silver content and a preparation method thereof. The conductive silver paste is composed of 5-30wt% self-made nano flake silver powder, 9.6wt% polymer resin, 0.5-3wt% Conduction promoter and 57.4‑84.9 wt% solvent composition. The preparation method is as follows: 1) Preparation of organic carrier 2) Selection according to the weight percentage of the formula; 3) Weighing the solvent and conductive promoter according to the formula and mixing them evenly; 4) Adding self-made nano flake silver powder according to the formula and dispersing evenly; 5) Pressing Add polymer resin to the formula and stir until a uniform conductive silver paste is formed. After the conductive silver paste is solidified and formed into a film, the conductivity is excellent, and the adhesion reaches grade 0. The silver content in the paste is much lower than commercial conductive silver paste (50‑90 wt%), which greatly reduces production costs and has broad market application prospects.

Description

technical field [0001] The invention belongs to the technical field of conductive material composites, and in particular relates to a conductive silver paste and a preparation method thereof. Background technique [0002] In recent years, conductive silver paste has been widely used in the printed electronics industry, such as integrated circuits, solar cells, radio frequency identification tags, thin film transistors, biosensors, etc. Conductive silver paste refers to a kind of electronic paste printed on PET, ceramics, glass, cardboard and other insulators to enable current transmission and static charge removal capabilities. It is a key raw material for various electronic components and electrodes and other electronic products. [0003] According to the curing temperature, conductive silver paste can be divided into high-temperature sintered silver paste, medium-temperature sintered silver paste and low-temperature cured silver paste. Among them, low-temperature curing s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 申玉求陈振兴王丹周勇刘意林思远
Owner 深圳市博耀科技集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com