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Anode plate, preparation method thereof and display panel

A display panel and anode plate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of poor long-term use stability and low product yield, and improve anti-oxidation performance, reduce dark lines, The effect of improving device yield and long-term use stability

Active Publication Date: 2019-11-12
SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects of dark lines in the preparation process of the anode plate in the prior art, which lead to low product yield and poor long-term use stability, and then provide an anode plate and its preparation method, display panel

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  • Anode plate, preparation method thereof and display panel
  • Anode plate, preparation method thereof and display panel

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preparation example Construction

[0041] In addition, the present invention also provides a method for preparing the above-mentioned anode plate. Referring to 2, the method for preparing the anode plate includes the following steps:

[0042] The anode layer, the first protective layer, the conductive metal layer and the second protective layer are sequentially sputtered on the substrate, so that the first protective layer, the conductive metal layer and the second protective layer form a lead layer, and the anode layer and the second protective layer are sputtered. The wiring layer is sequentially exposed, developed, etched and stripped, and patterned to design the patterned wiring layer;

[0043]Sputtering an outer protective layer on the patterned lead layer, for example, physical vapor deposition (Physical Vapor Deposition, PVD) can be used to plate molybdenum (Mo). In order to ensure the barrier effect, the thickness of Mo should not be too small, generally not less than

[0044] The outer protective lay...

Embodiment 1

[0051] This embodiment provides an anode plate, such as figure 1 As shown, the anode plate is arranged on the substrate 1, specifically, the substrate 1 is glass, and also includes an anode layer 2, which is stacked on the substrate 1;

[0052] The patterned lead layer 3 is stacked on the anode layer 2. The patterned lead layer 3 includes a first protective layer 3a, a second protective layer 3c and a conductive metal layer 3b disposed between them. The anode layer 2 is far away from the substrate 1. One side is provided with the first protective layer 3a; specifically, the ratio of the thickness of the anode layer 2 to the first protective layer 3a is 1:1-25:1, for example, the thickness of the anode layer 2 is 100nm-250nm; the first protective layer The thickness of 3a is 10nm-100nm, by optimizing the thickness ratio of the anode layer 2 and the first protective layer 3a, it is beneficial to improve the bonding effect between the two.

[0053] The outer protective layer 4 c...

Embodiment 2

[0057] The present embodiment provides the preparation method of above-mentioned anode plate, refer to figure 2 Shown, the preparation method of anode plate comprises the steps:

[0058] The anode layer, the first protective layer, the conductive metal layer and the second protective layer are sequentially sputtered on the substrate, so that the first protective layer, the conductive metal layer and the second protective layer form a lead layer, and the anode layer and the second protective layer are sputtered. The wiring layer is sequentially exposed, developed, etched and stripped, and patterned to design the patterned wiring layer;

[0059] Sputter an outer protective layer on the patterned lead layer, for example, PVD molybdenum (Mo) plating can be used. In order to ensure the barrier effect, the thickness of Mo should not be too small, generally not less than

[0060] The outer protective layer is sequentially exposed, developed, etched and degummed, and the patterned...

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Abstract

The invention provides an anode plate, a preparation method thereof and a display panel. According to the anode plate, a graphical lead layer comprises a first protective layer, a second protective layer and a conducting metal layer arranged between the first protective layer and the second protective layer, and erosion of water oxygen in the air on the conducting metal layer is weakened through the arrangement of the first protective layer and the second protective layer. More importantly, outer protective layers are arranged creatively, wherein the outer protective layers wrap the graphicallead layer and an anode layer, and the adjacent outer protective layers are arranged at intervals. Through the arrangement, the situation that the water oxygen in the air enters a lead from the edge of the graphical lead layer can be avoided, the anti-oxidation performance of the lead layer is improved, concealed wires and other bad problems are reduced, and device yield and long-term applicationstability are improved.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to an anode plate, a preparation method thereof, and a display panel. Background technique [0002] A PMOLED (Passive matrix Organic Light-Emitting Diode) display device consists of an anode, an organic light-emitting film, and a cathode. After a voltage is applied across the PMOLED, the cathode outputs electrons to the organic molecule emission layer, and the anode outputs holes to the organic layer. At the junction of the emission layer and the conduction layer, the electrons will combine with the holes. When an electron encounters a hole, it fills it, and when this happens, the electron releases energy in the form of a photon. PMOLED lighting adopts a progressive scanning method. After a row of scanning is completed, the pixels of this row will be turned off. At this time, the brightness of the pixel is related to the applied voltage. The higher the voltage, the gre...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/12H10K59/131H10K50/81H10K50/814H10K50/84
Inventor 孟京京郝力强冯峰
Owner SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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