Semiconductor component packaging method and alignment mold thereof

Abstract

The invention relates to a semiconductor component packaging method and an alignment mold thereof. The method comprises the steps that a number of semiconductor components are arranged on the surfaceof a substrate; a release agent or a non-stick layer is coated in a number of molding cavities of a mold, wherein the area of the substrate is greater than the area of the mold; an encapsulant is arranged in the molding cavities of the mold; the semiconductor components on the substrate are aligned with the molding cavities of the mold, so that the encapsulant covers the semiconductor components on the substrate; after the encapsulant is hardened and molded, the mold is separated from the encapsulant to complete the packaging of the semiconductor components. The use of the release agent or thenon-stick layer can effectively control the size and shape of encapsulant molding. When the substrate with a large action area is used, the flow of excess encapsulant can be controlled to prevent theencapsulant from overflowing to the non- packaged surface of the substrate.

Description

Technical field [0001] The invention is a packaging method of a semiconductor element and an alignment mold thereof, which can effectively control the size and shape of the packaging glue molding, and is beneficial to a packaging structure that improves the packaging quality. Background technique [0002] Light-Emitting Diode (LED; Light-Emitting Diode) has the characteristics and advantages of long life, small size, low power consumption, fast response speed, no radiation and monochromatic light emission, so it is widely used in indicator lights, Advertising billboards, traffic lights, car lights, display panels, communication appliances, consumer electronics and other products. [0003] Among the manufacturing processes of semiconductor devices and light-emitting diodes, packaging is a relatively downstream process step. But only after being packaged, can the semiconductor components or light-emitting diodes be practically used. Taking the light-emitting diode as an example, th...

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Problems solved by technology

[0004] However, if the shape of the encapsulant is not as expected, or the alignment between the encapsulant and the light-emitting diode die is not accurate, it will often cause the light source produced by the light-emitting diode die to fail to be exported through the encapsulant as expected. Or the derived light type or angle is different from the preset value, thereby affecting the luminous efficiency and practicability of the light-emitting diode device

Therefore, light-emitting diodes have high requirements for packaging. Usually, high-precision die-bonding machines and alignment equipment before packaging must be used, which will increase the installation cost of light-emitting diodes.

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