A kind of encapsulation method of frequency source and frequency source

A packaging method and frequency source technology, applied in the field of frequency sources, can solve the problems of large size of frequency source components, single function and narrow frequency band, unfavorable miniaturization development, etc., and achieve the effect of satisfying miniaturization and reducing product volume and weight.

Active Publication Date: 2021-03-16
SICHUAN JIUZHOU ELECTRIC GROUP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the process of realizing the present application, the inventors found that most of the existing miniaturized frequency source components are used for a single function and a narrow frequency band. In high-frequency products such as millimeter waves, they are basically still at the module level, which is not conducive to the development of miniaturization

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  • A kind of encapsulation method of frequency source and frequency source
  • A kind of encapsulation method of frequency source and frequency source

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Embodiment Construction

[0011] In the process of realizing this application, the inventors found that most of the existing miniaturized frequency source components are used for single function and narrow frequency band, while the volume of components in multi-functional and wide frequency band technology is not small, especially in millimeter wave Among the high-frequency products such as high-frequency products, they are basically at the module level, which is not conducive to the development of miniaturization. Although some have achieved miniaturization, their functions and frequency bands have limitations. For example, in the patent "A Miniaturized and Highly Airtight Frequency Source and Its Packaging Method", it is mainly explained that a conventional digital frequency source is usually composed of a phase-locked loop (PLL) chip, a loop low-pass filter circuit, a voltage-controlled The oscillator (VCO) is composed of a planar assembly method. Although the volume and size are similar, the realiza...

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Abstract

According to a packaging process of a frequency source and the frequency source provided by the embodiment of the invention, the packaging of the frequency source is realized by adopting a three-dimensional stacking mode, so that the volume and the weight of the frequency source are greatly reduced, and the volume can be reduced by 80% on the basis of the original assembly volume.

Description

technical field [0001] The present application relates to the technical field of frequency source manufacturing, in particular to a frequency source packaging method and the frequency source. Background technique [0002] Identification of friend or foe is one of the important means of military confrontation in the modern information battlefield. Secondary radar is the core hardware device of the identification of friend or foe system, and its quality directly affects the performance of the identification system. As the core component of the radar, the frequency source is mainly used to provide radio frequency excitation signals to the radar transmitter, to provide a variety of local oscillator signals down-converted with echo signals to the radar receiver, and to provide reference signals for the signal processing system. The frequency source is the heart of the radar system, and its phase noise, frequency hopping time, spurious suppression and other indicators have an impo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03L7/16
CPCH03L7/16
Inventor 邓小峰孙敏
Owner SICHUAN JIUZHOU ELECTRIC GROUP
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