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A Method of Establishing Wafer Backside Graph Database

A graphic data and database technology, applied in still image data retrieval, special data processing applications, electrical components, etc., can solve problems such as wafer scrapping, yield loss, and affecting normal shipments, so as to improve yield and avoid pollution Effect

Active Publication Date: 2021-10-19
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for establishing a wafer back graphic database, which is used to solve the problems in the prior art due to the contamination of the wafer back in the wafer manufacturing process. Scrap, yield loss, and issues affecting normal shipments

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  • A Method of Establishing Wafer Backside Graph Database
  • A Method of Establishing Wafer Backside Graph Database
  • A Method of Establishing Wafer Backside Graph Database

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Embodiment Construction

[0020] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0021] see Figure 1 to Figure 5 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides a method for establishing a graph database on the back of a wafer, which at least includes: providing a bare wafer, growing a layer of silicon dioxide on the back of the wafer; sending the wafer into a machine to make the silicon dioxide on the back of the wafer The silicon touches the components inside the machine and passes through all the running paths of the machine; scans the back of the wafer to obtain the graphic data information of the machine components; establishes a database for the graphic data information, and records wafer problems that occur on the production line Comparing with the graphic data information in the database, the problematic machines are obtained. The present invention can quickly and safely obtain the operation status of the machine by rubbing the graphic data of the machine on the back of the wafer, facilitates the rapid search of problematic machines, avoids further pollution to the wafer, and improves the yield rate of products.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for establishing a graph database on the back of a wafer. Background technique [0002] During the wafer production process, the back of the wafer is damaged after continuous film growth, wet cleaning, and contact with the machine cavity, wafer adsorption tray, etc. On a higher technology platform, the process window tends to be smaller, and the 55nm process has less impact on the back side, which is even worse. On the 28nm technology platform, it often causes serious crystal surface defects, and there is a back pressure alarm on the process machine , unable to perform normal work, leading to wafer scrapping; or due to defects in the photolithography process and the source of particle defects, the yield rate of the product is reduced, and the macroscopic abnormality of the crystal back affects normal shipments. [0003] Therefore, a new method needs to be prop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/67G06F16/50
CPCG06F16/50H01L21/02H01L21/67242
Inventor 周健刚
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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