Optical module

An optical module and laser technology, applied in the field of optical modules, can solve the problems of poor optical coupling effect and achieve the effect of ensuring optical coupling effect

Inactive Publication Date: 2019-11-26
HISENSE BROADBAND MULTIMEDIA TECH
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  • Abstract
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Problems solved by technology

[0005] The present invention provides an optical module to solve the problem of poor optical coupling effect when the existing optical module is applied on a COB process platform

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] One of the core links of optical fiber communication is the conversion of photoelectric signals. Optical fiber communication uses optical signals carrying information to be transmitted in optical fibers / optical waveguides, and low-cost, low-loss information transmission can be achieved by using the passive transmission characteristics of light in optical fibers. However, information processing equipment such as computers use electrical signals,...

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Abstract

The invention discloses an optical module, which adopts a separation structure according to different optical power attenuation requirements and comprises a first lens assembly and a second lens assembly, wherein the top of the first lens assembly is provided with a filter, the filter is provided with an optical fiber interface on the side away from the light incoming surface, optical signals fromthe optical fiber interface are transmitted to the filter and reflected, and the reflected light is transmitted into a light receiving chip array located at the bottom of the second lens assembly. The top of the first lens assembly forms a reflecting surface, optical signals emitted by the laser chip array are transmitted to the reflecting surface and reflected, and the reflected light is emittedfrom a light emitting surface and enters an optical fiber interface in the second lens assembly. The optical signal power attenuation degree of the first lens assembly is greater than that of the second lens assembly, so that the first lens assembly can attenuate the optical power of the optical signals emitted by the laser chip array, the optical power finally coupled into the optical fiber interface is enabled to be consistent with the optical power required by the optical fiber interface, and the optical coupling effect is ensured.

Description

technical field [0001] The invention relates to the technical field of optical fiber communication, in particular to an optical module. Background technique [0002] The COB (chip On board) process platform in the packaging of optical module products has the advantages of low cost, high density, good high-frequency performance, and simple packaging process. More and more optical modules will be made of traditional coaxial or micro-optical The process platform is converted to a COB process platform. At present, the multi-mode parallel optical fiber packaging technology has been widely used in COB production technology platform for production, but for the multi-mode single-fiber bidirectional technology or wavelength division multiplexing technology, due to the factors such as cost and technology have not been well resolved, it has not yet been used in the COB process. implemented on the platform. [0003] In order to realize the multi-mode single-fiber bidirectional technol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4206G02B6/4214G02B6/4215
Inventor 邵乾刘旭霞罗成双宿靖啟
Owner HISENSE BROADBAND MULTIMEDIA TECH
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