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Power conversion device

A power conversion device and power semiconductor technology, which is applied in the direction of converting irreversible DC power input into AC power output, supporting structure installation, and converting equipment structural parts, etc., can solve the problem of increasing the size of filter capacitors, increasing the number of capacitor elements, Thickness of insulating resin, etc.

Active Publication Date: 2019-11-26
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to increase the capacity of the power conversion device, it is necessary to increase the number of capacitor elements or increase the size
In addition, in order to increase the withstand voltage of the power conversion device, it is necessary to increase the thickness of the insulating resin covering the capacitor element.
Therefore, it is necessary to increase the size of the case member of the filter capacitor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0027] figure 1 It is a configuration diagram showing the power conversion device 100 according to Embodiment 1 of the present invention. Such as figure 1 As shown, the power conversion device 100 according to Embodiment 1 has the case 7 fixed to the upper surface 2a of the water-cooled heat sink 2 having the cooling water passage 2e. Power conversion device 100 includes power semiconductor element 1 , substrate 3 for controlling and driving power semiconductor element 1 , and support case 4 in which DC input terminal 4 a and AC output terminal 4 b electrically connected to power semiconductor element 1 are mounted in case 7 .

[0028] A plurality of power semiconductor elements 1 are arranged on an upper surface 2 a of the heat sink 2 , and relay terminals 1 a extending upward from each power semiconductor element 1 are electrically connected to a substrate 3 arranged above each power semiconductor element 1 . Furthermore, the support case 4 in which the bus bar 4c is inser...

Embodiment approach 2

[0047] Figure 4 is a configuration diagram showing a power conversion device 200 according to Embodiment 2 of the present invention. A power conversion device 200 according to Embodiment 2 is different from Embodiment 1 in that a bent portion 5 g is formed at a bus bar 5 a of a filter capacitor 5 . Other structures are the same as those in Embodiment 1.

[0048] Such as Figure 4 As shown, in the power conversion device 200 according to Embodiment 2, the thickness of the bus bar 5 a connecting the filter capacitor 5 and the DC input terminal 4 a is set to 1.8 mm or less, and the bent portion 5 g is formed.

[0049] In power conversion device 200 , during high-load operation after startup, the temperatures of filter capacitor 5 and support case 4 rise, and the temperature difference between them and radiator 2 increases. Then, there is generated between the amount of thermal expansion obtained by adding the amount of thermal expansion of the boss portion 2b and the amount o...

Embodiment approach 3

[0053] Figure 5 It is a figure which shows the power conversion apparatus 300 which concerns on Embodiment 3 of this invention. The power conversion device 300 according to the third embodiment is different from the first embodiment in that a metal intermediate sleeve 9 is disposed between the leg portion 5d of the case member 5b and the boss portion 2b. Other structures are the same as those in Embodiment 1.

[0054] Such as Figure 5 As shown, in the power conversion device 300 according to Embodiment 3, each leg portion 5d formed on the case member 5b of the smoothing capacitor 5 is fixed to each shaft extending from the heat sink 2 via the metal intermediate sleeve 9 . Cover part 2b.

[0055] Then, in the power conversion device 300 according to the first embodiment configured in this way, the linear expansion coefficient of the boss portion 2b is set to αh, and the height from the upper surface 2a of the heat sink 2 to the seat surface 2c of the boss portion is set to...

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Abstract

A power conversion device having: a power semiconductor element; a support case to which an AC output terminal and a DC input terminal connected to the power semiconductor element are attached; a heatsink having a plurality of boss parts on the upper surface thereof, the power semiconductor element and the support case being attached to the heat sink; a smoothing capacitor having a case member onwhich a plurality of leg parts are formed; and a bus bar for connecting the smoothing capacitor and the DC input terminal, the plurality of leg parts of the case member being respectively fixed to the plurality of boss parts of the heat sink, wherein the boss parts, the leg parts, the support case, and the bus bar are formed using dimensions and materials at which the sum of the amount of expansion / contraction of the boss parts and the amount of expansion / contraction of the leg parts due to heat is within the range of 0.9-1.1 in relation to the sum of the amount of expansion / contraction of the support case and the amount of expansion / contraction of the bus bar.

Description

technical field [0001] The present invention relates to a power conversion device having a filter capacitor mounting mechanism that is not affected by a difference in thermal shrinkage between the filter capacitor and a case in which the filter capacitor is mounted. Background technique [0002] In recent years, the development and market investment of electric vehicles, hybrid vehicles, and fuel cell vehicles that use electric power in addition to the existing internal combustion engine have been rapidly increasing for the purpose of environmental protection and fuel efficiency. The aforementioned automobiles are equipped with a power conversion device that converts electricity into power. [0003] The casing of the power conversion device accommodates components such as a water-cooled radiator for cooling heating elements such as switching elements, a control circuit board, and a boost converter. In addition, components such as filter capacitors for suppressing pulse curr...

Claims

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Application Information

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IPC IPC(8): H02M7/48
CPCH02M7/003H05K7/20927H02M7/48H01L25/072H01L25/18H01L23/4006H01L2023/4062H05K7/14329H01L23/42H01L23/473H01L2023/4087H05K7/1432H05K7/2039
Inventor 桥居直也水野贺文
Owner MITSUBISHI ELECTRIC CORP