Microwave assembly gold belt interconnection transmission performance prediction method based on interconnection form

Abstract

The invention discloses a microwave assembly gold belt interconnection transmission performance prediction method based on an interconnection form, and the method comprises the steps: determining goldbelt interconnection geometric parameters, physical parameters and electromagnetic transmission parameters, carrying out parametric representation of a gold belt interconnection structure form, and building a gold belt interconnection structure-electromagnetic analysis model; screening and recognizing shape effect key parameters a; constructing a gold belt interconnectivity multiple regression model; regression equation precision inspection and parameter correction; and establishing a gold strip interconnection transmission performance prediction model. Key parameter identification of the microwave assembly gold belt interconnection structure for high-frequency signal transmission can be realized A gold strip interconnection transmission performance prediction model is established, and the model can realize accurate prediction from microwave interconnection structure morphological parameters to signal transmission performance, can be used for guiding design, manufacturing and optimization of microwave components, effectively improves the development quality of microwave products, saves the cost and shortens the development period.

Description

technical field [0001] The invention belongs to the technical field of microwave radio frequency circuits, and specifically relates to a method for predicting the interconnection transmission performance of gold ribbons of microwave components based on the interconnection form, which can be used to guide the interconnection design and the regulation of electromagnetic transmission performance in microwave components. Background technique [0002] Microwave circuits and devices are widely used in IoT communications, radar detection, chip components and other aerospace fields. Nowadays, the development trend of microwave electronic equipment is increasingly integrated, miniaturized, highly reliable and high-speed, which puts forward extremely strict requirements for the assembly and interconnection of microwave circuits and devices in microwave components. The design of the interconnection form in microwave components has a sharp and significant impact on signal transmission p...

AI Technical Summary

Problems solved by technology

However, changes in the interconnection form of the gold ribbon will have a significant impact on the transmission performance of high-frequency microwave signals. Most of the engineering research is based on manual experience and a large number of software simulations. Prediction model for transmission performance of gold ribbon interconnection of microwave components based on morphology

As a result, it is impossible to accurately and quickly give the optimal interconnection parameter design and optimal interconnection shape correlation control, resulting in high labor costs and low work efficiency

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