Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate processing method and substrate processing device

A substrate processing method and a substrate processing device technology, which are applied to chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as device quality degradation, and achieve the effect of inhibiting and reducing corrosion

Pending Publication Date: 2019-12-03
DAINIPPON SCREEN MTG CO LTD
View PDF10 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, since the metal wiring is corroded (etched), there is a possibility that the quality of the device (device) made of the substrate may be lowered.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing method and substrate processing device
  • Substrate processing method and substrate processing device
  • Substrate processing method and substrate processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0075] figure 1 It is a schematic top view for explaining the internal layout of the substrate processing apparatus 1 which is one embodiment of the present invention.

[0076] The substrate processing apparatus 1 is a sheet-type apparatus for processing substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a disk-shaped substrate. The substrate W has a surface on which a metal film such as copper (Cu), cobalt (Co), nickel (Ni), or manganese (Mn) is exposed. The substrate processing apparatus 1 includes: a plurality of processing units 2 for processing the substrate W with processing liquids such as chemicals or rinse liquids; a load port (load port) LP is loaded with a carrier (carrier) C, and the carrier C is used for Accommodates a plurality of substrates W processed by the processing unit 2; the transfer robot IR and the transfer robot CR transfer the substrate W between the load port LP and the processing unit 2; and the controller 3 con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A substrate processing method, including: a substrate holding step for holding a substrate that has a surface in which a metal is exposed; an inert gas substitution step for feeding an inert gas to the vicinity of the surface of the substrate and thereby substituting the atmosphere surrounding the surface of the substrate with an inert gas; an adjustment step for adjusting the pH of a rinsing liquid so as to form an inert state in which the metal does not react with the rinsing liquid, or so that the metal reacts with the rinsing liquid to form a passive state; and a rinsing liquid feeding step for feeding the pH-adjusted rinsing liquid to the surface of the substrate after the atmosphere surrounding the surface of the substrate has been substituted with the inert gas.

Description

technical field [0001] The invention relates to a substrate processing method and a substrate processing device for processing a substrate. Substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for FPD (Flat Panel Display) such as organic EL (Electroluminescence; electroluminescence) display devices, substrates for optical discs, substrates for magnetic disks, optical Substrates such as substrates for magnetic disks, substrates for photomasks, ceramic substrates, and substrates for solar cells. Background technique [0002] In substrate processing in a single-sheet substrate processing apparatus for processing substrates one by one, for example, a chemical solution is supplied to a substrate held substantially horizontally by a spin chuck. Thereafter, a rinse liquid is supplied to the substrate, thereby replacing the chemical liquid on the substrate with the rinse liquid. Afterwards, a spin-drying s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/304
CPCH01L21/02068H01L21/6708H01L21/67051H01L21/67017H01L21/67028H01L21/02052H01L21/02343H01L21/304H01L21/6715B08B3/08B08B2203/002H01L21/02057
Inventor 岩﨑晃久高桥弘明
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com