Wafer manufacturing tool and use method thereof

Abstract

The invention discloses a wafer manufacturing tool and a use method thereof and belongs to the field of wafer manufacturing. According to the wafer manufacturing tool and the use method thereof, a silicon single crystal rod is cut through a water cutting technology, the surface of a silicon wafer obtained through water cutting is smooth, edge breakage, micro-cracks, layering and other defects arenot liable to appear, meanwhile, a water cutter for cutting is also free of a loss problem, a hot burst generated by overheating of a cutter is not liable to occur, cutting sliding quality is not liable to be influenced, the water cutter can also achieve a cooling effect on the silicon rod, thus the silicon rod is not liable to trace deformation under a high-temperature cutting state, product precision of the silicon wafer produced by cutting is not liable to be influenced, and finish machining treatment of the silicon wafer is reduced substantially before photoetching. In addition, in the water cutting process, cutting locating automation is achieved through a control terminal, manual operation of technicians is not needed, cutting precision is improved substantially, production efficiency of wafers is improved, and the quality of the wafers is improved.

Description

technical field [0001] The present invention relates to the field of wafer manufacturing, more specifically, to a wafer manufacturing tool and a method for using the same. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer and become an IC with specific electrical functions. product. [0003] In the process of wafer preparation, single crystal silicon rods are usually prepared first, and then the single crystal silicon rods are cut and finished, and finally photolithography is carried out. Among them, the silicon wafer cutting methods mainly include diamond grinding wheel cutting, laser cutting : Laser cutting uses the high temperature generated by the high-energy laser beam to instantly gasify the silicon material in the irradiated local area and complete the s...

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Problems solved by technology

[0006] Aiming at the problems existing in the prior art, the object of the present invention is to provide a wafer manufacturing tool and its use method, which uses water to cut single crystal silicon rods, and is not prone to high temperature during the cutting process to cause edge chipping, Defects such as microcracks and delamination, and the cutting thickness of silicon wafers is determined by the technicians themselves, instead of only cutting thin wafers. The surface of the cut silicon wafers is relatively flat, which greatly reduces subsequent finishing processing and greatly improves Wafer production rate

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