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Equipment front-end module and production line

A front-end module and straight line technology of equipment, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of lower production efficiency, long time, damage to the vacuum environment of equipment, etc., to improve yield, reduce impact, improve The effect of production efficiency

Pending Publication Date: 2019-12-17
紫石能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the traditional EFEM does not have the particle cleaning function, the carrier used to load the wafer needs to be taken out from the front-end module of the equipment for cleaning and maintenance after a period of use. The traditional cleaning method is generally wet cleaning. Drying operation is required, and the time is often longer
Moreover, the process of taking out the carrier from the EFEM needs to open the equipment hatch, and opening the equipment hatch will destroy the vacuum environment of the equipment
These will affect the continuity of process production and reduce production efficiency

Method used

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  • Equipment front-end module and production line
  • Equipment front-end module and production line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides a device front-end module, such as figure 1 As shown, it includes: a cleaning chamber 2 arranged between the unloading chamber 4 and the loading chamber 1; the first end of the cleaning chamber 2 is connected to one end of the unloading chamber 4, and the second end of the cleaning chamber 2 is connected to the One end of the loading chamber 1 is connected; the cleaning chamber 2 is used for cleaning the carriers output from the unloading chamber 4 and transporting the cleaned carriers to the loading chamber 1 .

[0036]Specifically, a cleaning chamber 2 is provided between the unloading chamber 4 and the loading chamber 1, that is, the first end of the cleaning chamber 2 is connected to one end of the unloading chamber 4, so that objects can be cleaned between the cleaning chamber 2 and the unloading chamber. It only needs to transport between the chambers 4; the second end of the cleaning chamber 2 is connected to one end of the loading chambe...

Embodiment 2

[0054] This embodiment is basically the same as Embodiment 1. For the sake of brevity, in the description process of this embodiment, the same technical features as Embodiment 1 will not be described, and only the differences between this embodiment and Embodiment 1 will be described:

[0055] Such as figure 2 As shown, the first end and the second end of the cleaning chamber 2 in the front-end module of the equipment are arranged opposite to each other, that is, the conveying direction of the carrier from the loading chamber to the unloading chamber is along a straight line; the loading chamber 1, the cleaning chamber 2 and the unloading chamber Chamber 4 is in the conveying direction where the third straight line is located, such as figure 2 As shown, that is, the direction of the third straight line is the same as figure 2 Corresponding to the direction indicated by the arrow in , the loading chamber 1, cleaning chamber 2, and unloading chamber 4 are sequentially connec...

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Abstract

The invention relates to the field of semiconductors, and discloses an equipment front-end module and a production line. The equipment front-end module comprises a cleaning chamber disposed between anunloading chamber and a loading chamber, wherein the first end of the cleaning chamber is connected with one end of the unloading chamber, and the second end of the cleaning chamber is connected withone end of the loading chamber; and the cleaning chamber is used for cleaning a carrier output from the unloading chamber and conveying the cleaned carrier to the loading chamber. When the equipmentfront-end module performs self-cleaning on the carrier, water washing and drying are not needed, and the carrier does not need to be taken out to damage the vacuum state in the equipment; it is strictly guaranteed that the content of carrier particles entering a next-step process processing chamber reaches the standard, so that the influence on the next-step process is reduced, and the yield is improved; and the self-cleaned carrier can be continuously used and does not need to be frequently taken out for maintenance, so that the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an equipment front-end module and a production line. Background technique [0002] The semiconductor manufacturing industry is characterized by ultra-precision, ultra-clean environment and miniaturization. Its processing technology involves nearly a hundred procedures, and many important process environments need to be completed in a vacuum environment. During the processing, the substrate needs to be efficiently transported and positioned between different processing modules on the production line. The Semiconductor Equipment Front-End Module (EFEM) is the key equipment to complete this task. It is in line with the semiconductor process precision and Purification requirements, with high precision, high efficiency, high cleanliness and high reliability, is a bridge connecting the material handling system and the wafer processing system, enabling the wafer to be accurately transporte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02H01L21/67011
Inventor 陈健健姚立强陆涛田洪生赵兵权
Owner 紫石能源有限公司