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Cutting process for large-size silicon wafer

A cutting process and technology of silicon wafers, applied in the direction of work accessories, manufacturing tools, stone processing equipment, etc., can solve problems such as poor warpage consistency, easy bending of the surface, and excessive silicon powder

Inactive Publication Date: 2019-12-20
TIANJIN ZHONGHUAN ADVANCED MATERIAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The larger the size, the easier the surface is to bend during the cutting process, and the warpage consistency is poor; as the cutting depth increases, there will be more silicon powder remaining on the surface, which is not easy to clean

Method used

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  • Cutting process for large-size silicon wafer
  • Cutting process for large-size silicon wafer
  • Cutting process for large-size silicon wafer

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Embodiment Construction

[0024] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0025] The present invention proposes a large-size silicon wafer cutting process, such as figure 1 As shown, the steps include:

[0026] S1: bonding the silicon round rod 20 to the resin plate.

[0027] Before sticking the rod, the silicon round rod 20 with a length of 350 mm and a diameter of 300 mm is cleaned with absolute ethanol on the outer edge wall surface of the silicon round rod 20 in the length direction to remove surface impurities, which is convenient for sticking the rod in the next step. Then the silicon round rod 20 after wiping is placed on the automatic sticking stick orientation instrument, the crystal orientation of the silicon round stick 20 is tested and the sticking operation is carried out. The sticking stick orientation instrument model is DX-7DZ. Q-Bond series stick glue is used in the sticking process. The glue use...

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Abstract

The invention provides a cutting process for a large-size silicon wafer. The third step of the process is that mortar online cutting is performed on a silicon round bar with the diameter of 300 mm ona cutting machine and the silicon wafer is obtained; in a cutting process, the feeding speed of the silicon round bar is 0.22-0.47 mm / min; the wire diameter of the steel wire is 0.16 mm, the cutting speed is 600-800 m / min, the wire supply amount is 0.46-0.74 km / pcs, the supply and return tension is 24-28 N, and the wire arch is smaller than 3 mm; and the flow rate of mortar is 82-145 Kg / min, and the flow fluctuation value is + / -3 Kg / min. The cutting process for the large-size silicon wafer is particularly suitable for mortar online cutting of the silicon round bar with the diameter of 300 mm,the geometric parameters such as warping degree and bending degree of the silicon wafer are guaranteed, and the large-size silicon wafer with excellent surface morphology and convenient to clean is obtained.

Description

technical field [0001] The invention belongs to the technical field of semiconductor silicon wafer manufacturing, and in particular relates to a large-size silicon wafer cutting process. Background technique [0002] According to Gartner's data, it is estimated that by 2020, the global silicon wafer market will reach 11 billion US dollars. The world's top five silicon wafer manufacturers (Japan's Shin-Etsu, Japan's SUMCO, China's Taiwan GlobalWafer, Germany's Siltronic and South Korea's LGSiltron) account for 94% of the silicon wafer market. In the field of 300mm silicon wafers, the top five manufacturers will This figure improved to 97.8%. As an important link in the semiconductor industry, silicon wafer manufacturing has also ushered in development opportunities. Judging from the current production capacity construction of global fabs, large-sized fabs are the current mainstream construction direction, and the diameter of large-sized wafers is not less than 300mm. The l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/04B28D7/02
CPCB28D5/007B28D5/0076B28D5/0082B28D5/045
Inventor 常雪岩武卫孙晨光刘建伟由佰玲刘园谢艳杨春雪刘秒裴坤羽祝斌吕莹徐荣清
Owner TIANJIN ZHONGHUAN ADVANCED MATERIAL TECH
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