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Novel floor for floor heating

A geothermal floor, a new type of technology, applied in the direction of elastic floor, floor, covering/lining, etc., to achieve the effect of low drying requirements, high thermal conductivity, and energy saving and consumption reduction

Pending Publication Date: 2019-12-20
ZHEJIANG LINGGE WOOD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical purpose of the present application is to overcome the above technical problems, thereby providing a new type of geothermal floor, which has extremely high thermal conductivity, and at the same time has relatively good dimensional stability and mildew resistance, so as to facilitate the rapid heating of the room, Conducive to saving heating energy consumption, and no deformation, mildew problems

Method used

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  • Novel floor for floor heating
  • Novel floor for floor heating
  • Novel floor for floor heating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Example 1: Reference figure 1A new type of geothermal floor shown includes a decorative layer 100 and a base material layer 200 that are glued to each other. Wherein, the decorative layer 100 is a hardwood material layer, such as oak veneer with a thickness of 0.1mm-5.0mm, preferably, the thickness is 2.0mm-3.0mm; the base material layer 200 is a metal material layer, such as an integrally formed aluminum alloy substrate. The decoration layer 100 and the base layer 200 are bonded and bonded by thermosetting glue or cold-setting glue, for example, polyurethane glue, water-based glue and the like. The total thickness of this new type of geothermal floor is 6mm-22mm, and a locking structure is formed around the body.

[0038] In this embodiment, the part of the substrate layer 200 used to form the locking structure is a solid structure, and the locking structure is formed by milling, while the other part (main part) of the substrate layer 200 is a hollow structure.

[0...

Embodiment 2

[0040] Embodiment 2: the difference between embodiment 2 and embodiment 1 is that reference figure 2 As shown, the buffer layer 300 is disposed on the bottom surface of the base material layer 200 , and its bonding method to the bottom surface of the base material layer 200 is the same as that in Embodiment 1.

Embodiment 3

[0041] Embodiment 3: the difference between embodiment 3 and embodiment 1 is that, refer to image 3 As shown, the substrate layer 200 is a split structure. The base material layer 200 includes an adhesive connection structure 210 on the bottom surface of the decoration layer 100 , and a support module 220 fixed on the bottom surface of the connection structure 210 by clamping. The support module 220 is composed of a plurality of support units 221 that are clamped and connected to each other; the plurality of support units 221 form 2-6 rows (preferably 3 or 4 rows) of support units 221 in the width direction. 8-16 rows (preferably 10-12 rows) of supporting monomers 221 are formed in the direction.

[0042] refer to Figure 4 As shown, the connecting structure 210 includes a connecting plate 211, a first clamping member 212 fixed on the back of the connecting plate 211, a locking module 300 fixed on the surrounding sides of the support module 220 by clamping, and a locking mo...

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Abstract

The invention provides a novel floor for floor heating. The novel floor for floor heating comprises a decorative layer and a matrix layer which adhere to each other. The decorative layer is a hard wood material layer. The matrix layer is a metal material layer. The novel floor for floor heating has remarkably higher heat conduction efficacy, air in a room is rapidly heated beneficially, and energyconservation and consumption reduction of heating are facilitated; and besides, the novel floor for floor heating is not prone to generating deformation or being mouldy and corroded, and the dry condition requirement for cement ground is low.

Description

technical field [0001] The present application relates to the technical field of wooden floor structures, in particular to a novel wooden geothermal floor structure. Background technique [0002] With the popularity of floor heating, more and more researches have been done on the application of wooden floors in floor heating environments. However, there are still some problems in the application of wooden floors in floor heating environments. In one aspect, the thermal conductivity of wooden materials is poor, and the thermal conductivity of hardwood solid wood materials is only 0.18W / M. K. Taking a room with an area of ​​12㎡ as an example, the setting temperature of the floor heating device is 40°C. When the equilibrium state is reached, the temperature on the surface of the wooden floor is only 28-30°C, and the temperature at a height of 1.5 meters in the room is only 23-25°C. ℃. Therefore, the wooden floor increases the energy consumption of heating due to its low ther...

Claims

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Application Information

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IPC IPC(8): E04F15/02E04F15/04E04F15/22
CPCE04F15/02E04F15/02038E04F15/041E04F15/225E04F2201/023E04F2290/023E04F2203/04E04F2201/043
Inventor 刘彬彬肖五旦
Owner ZHEJIANG LINGGE WOOD
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