Capacitor vapor deposition negative pressure gold plating device and gold plating method

Abstract

The capacitor vapor deposition negative pressure gold-plating device and its gold-plating method include a plurality of the exhaust pans and the distribution between the upper and lower material ports in an annular array; the bottom of each of the exhaust pans is connected to a gold-plating mechanism; The bottom end of the gold-plating mechanism communicates with the molten material storage chamber, and the outlet end of the gold-plated mechanism is placed in the sealed cover; the gold-plated mechanism is used to extract a certain amount of molten material and heat it into gaseous material to spray out; The inside of the sealing cover is equipped with a station switching mechanism, the bottom surface of the station switching mechanism is magnetically attached to the iron template, and the bottom surface of the template is embedded with a plurality of core bodies; the station switching mechanism is used to drive The template is cyclically and sequentially switched between multiple sets of exhaust trays and the loading and unloading ports; the present invention can process vapor deposition on the end face of the battery cell, so that the forming thickness of the electrode face is more uniform without omission, and the electrical conductivity is improved. surface conductivity.

Description

technical field [0001] The invention belongs to the technical field of processing metallized film capacitors, in particular to a capacitor vapor deposition negative pressure gold plating device and a gold plating method thereof. Background technique [0002] Gold spraying refers to the use of heat sources such as electric arc or flame to melt all kinds of solder materials to be sprayed and atomize them under the action of high-pressure air; the crushed metal particles are sprayed at high speed on the capacitor core assembly surface with high sensitivity to heat energy In the film gap, the end face of the core group forms an equipotential metal electrode surface from the inner winding layer to the outer winding layer, providing a bridging platform for electrode extraction; [0003] The traditional gold spraying method is to insert multiple batteries into the surface of the template by the worker, and then install the template at the loading and unloading station in the gold s...

AI Technical Summary

Problems solved by technology

[0004] There are defects in the traditional gold spraying operation: 1. Since the gold spraying process is point-to-face processing, the coverage of the spray gun is limited, and the conductive material sprayed from the spray gun spreads around. The central area has higher strength and a shorter stroke, which is easy to stick It fits on the cell gap to form a qualified coating, but the conductive material at the edge has a long stroke, resulting in insufficient final potential energy, and the thickness and strength of the coating will be affected, which will eventually lead to insufficient uniformity of the processed metal conductive layer of the cell and poor conductivity. Performance decline; 2. Due to the weak bonding ability between the initially sprayed conductive material and the surface of the battery cell, one-time gold spraying process is used. Once the initial conductive layer is not well formed, subsequent gold spray coatings will follow. Changes , poor reliability

Images