A polishing pad dressing device and dressing method
A technology of dressing device and polishing pad, which is applied in grinding/polishing equipment, abrasive surface adjustment device, parts of grinding machine tools, etc. , Ensure polishing quality and improve the effect of flatness
Active Publication Date: 2022-02-01
XIAN ESWIN MATERIAL TECH CO LTD +1
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Problems solved by technology
[0003] In view of this, the present invention provides a dressing device and a dressing method for a polishing pad, which are used to solve the problems that the silicon wafer is easily scratched by the particles and impurities accumulated on the polishing pad and the surface flatness of the silicon wafer is not good during the polishing process of the silicon wafer.
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[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.
[0035] Such as figure 1 As shown, the embodiment of the present invention relates to a single-side polishing process of a silicon wafer. In the polishing process, the top is a polishing head 300, and the number of polishing heads can be one, or two or more. A polishing table 100 is arranged below, a polishing pad 200 is attached to the upper surface of the polishing table 100 , and a silic...
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Abstract
The present invention provides a dressing device and a dressing method for a polishing pad. The dressing device includes: a dresser, the dresser includes a cylindrical dresser body and a dresser groove provided on the dresser surface of the dresser body. The trimming groove includes a circular groove and a cross groove located in the area enclosed by the circular groove, and the four ends of the cross groove communicate with the circular groove. According to the trimming device and trimming method of the embodiment of the present invention, by opening the trimming groove on the trimming surface of the trimmer, the residual particle impurities on the polishing pad can be effectively scraped off and the flatness of the surface of the polishing pad can be improved, thereby preventing silicon wafers from being Scratches occur during the polishing process, causing silicon wafers to be scrapped, which ensures the polishing quality of silicon wafers.
Description
technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a dressing device and a dressing method for a polishing pad. Background technique [0002] During the polishing process of the silicon wafer, the silicon wafer on the polishing head is in contact with the surface of the polishing pad attached to the rotating lower plate, and the polishing slurry and chemicals used between the silicon wafer and the polishing pad will grind and polish Pad and silicon wafer, under the joint action of the chemical reaction of polishing slurry and chemicals and the physical reaction caused by mechanical pressure, the surface of silicon wafer is polished. But at the same time, the surface morphology of the polishing pad will gradually become uneven, and as the shape of the surface of the polishing pad changes, various particles of impurities are more likely to accumulate on the surface of the polishing pad, which becomes the cause of d...
Claims
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IPC IPC(8): B24B53/017B24B53/12
CPCB24B53/017B24B53/12
Inventor 赵晟佑
Owner XIAN ESWIN MATERIAL TECH CO LTD