Monocrystalline silicon slicing device capable of freely adjusting size of wafer to be cut

A technology of slicing device and single crystal silicon, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of incomplete fixation, waste of production resources, and easy movement during single crystal silicon cutting, so as to increase the Practicality, saving resources, and ensuring the effect of production quality
CN110640919AInactive Publication Date: 2020-01-03江苏晶品新能源股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江苏晶品新能源股份有限公司
Publication Date
2020-01-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a monocrystalline silicon slicing device capable of freely adjusting size of a wafer to be cut, and belongs to the technical field of monocrystalline silicon. The slicing device comprises a working platform, wherein two groups of guide rollers are driven by a conveyor belt, a chip collecting box is installed in the center of an inner cavity of the working platform, and theend, away from fixing blocks, of a supporting rod is connected with a clamping device; and an electric telescopic rod is arranged in the center of the bottom of a rack, the bottom of the electric telescopic rod is connected with a fixing rod, the outer wall of the fixing rod is uniformly sleeved with sleeves, and cutting blades are arranged in the centers of the bottoms of the sleeves. The spacingbetween the sleeves is adjusted in the device, so that the device can cut the monocrystalline silicon into different sizes; the monocrystalline silicon is fixed by the clamping device, so that cutting exists in errors caused by the movement of the monocrystalline silicon are prevented; and meanwhile, the cutting blades rotate, so that blocking blocks rotate like fan blades to generate wind force,and chips generated by cutting on the working platform are blown to the chip collecting box, and the chips are prevented from splashing onto the monocrystalline silicon to damage the surface of the monocrystalline silicon.
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Description

technical field

[0001] The invention relates to the technical field of monocrystalline silicon, in particular to a monocrystalline silicon slicing device which can freely adjust the size of a cut wafer. Background technique

[0002] Single crystal of silicon, a crystal with a basically complete lattice structure, has different properties in different directions, is a good semiconductor material, used to manufacture semiconductor devices, solar cells, etc., the existing single crystal silicon is being processed and produced , it is necessary to cut a large volume of monocrystalline silicon into small parts, but the existing cutting device can only cut monocrystalline silicon into one size, which has great limitations, and the monocrystalline silicon is fixed during cutting. If it is not thorough, it is easy to move, causing cutting errors and wasting production resources. Therefore, we propose a single crystal silicon slicing device that can freely adjust the size of the cut ...

Claims

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